Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DNM1 | Q05193 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1608049 | 0.90 | DNM1 (0.33) | DNM1 | |
| SCHEMBL1609516 | 0.89 | DNM1 (0.36) | DNM1 | |
| SCHEMBL1608652 | 0.83 | — | — | |
| SCHEMBL6376881 | 0.83 | ADRB2 (0.35) | DNM1 | |
| SCHEMBL1608821 | 0.79 | — | — | |
| SCHEMBL6375988 | 0.78 | — | — | |
| SCHEMBL5746525 | 0.76 | DNM1 (0.42) | DNM1 | |
| SCHEMBL16497586 | 0.75 | DNM1 (0.41) | DNM1 | |
| SCHEMBL7527603 | 0.73 | DNM1 (0.46) | DNM1 | |
| SCHEMBL4612516 | 0.72 | DNM1 (0.38) | DNM1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 77 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11912889-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-27 | — | — | US | disclosed |
| US-20230257503-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-08-17 | — | — | US | disclosed |
| EP-4212256-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | Mitsubishi Chemical Corporation (JP) | 2023-07-19 | — | — | EP | disclosed |
| US-11542397-B2 | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-01-03 | — | — | US | disclosed |
| US-11413682-B2 | Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-08-16 | — | — | US | disclosed |
| US-20220220338-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-14 | — | — | US | disclosed |
| US-20220213348-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-07 | — | — | US | disclosed |
| US-11377522-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica-based coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-05 | — | — | US | disclosed |
| EP-3971229-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-03-23 | — | — | EP | disclosed |
| WO-2022054912-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | 三菱ケミカル株式会社 | 2022-03-17 | — | — | WO | disclosed |
| EP-2131423-A1 | NEGATIVE ELECTRODE BASE MEMBER | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2009-12-09 | — | — | EP | disclosed |
| US-20090156005-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | YOKOI SHIGERU | 2009-06-18 | — | — | US | disclosed |
| US-20080318165-A1 | Composition For Forming Antireflective Film And Wiring Forming Method Using Same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-12-25 | — | — | US | disclosed |
| US-7238462-B2 | Undercoating material for wiring, embedded material, and wiring formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-07-03 | — | — | US | disclosed |
| US-20060241012-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | YOKOI SHIGERU | 2006-10-26 | — | — | US | disclosed |
| US-20060141693-A1 | Semiconductor multilayer interconnection forming method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-06-29 | — | — | US | disclosed |
| EP-1566836-A1 | SEMICONDUCTOR MULTILAYER INTERCONNECTION FORMING METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-08-24 | — | — | EP | disclosed |
| US-20050112383-A1 | Undercoating layer material for lithography and wiring forming method using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-05-26 | — | — | US | disclosed |
| US-20050074695-A1 | Undercoating material for wiring, embedded material, and wiring formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-04-07 | — | — | US | disclosed |
| US-20040121937-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-06-24 | — | — | US | disclosed |