SCHEMBL1609097

SCHEMBL1609097

CCO[Si](Oc1ccccc1)(Oc1ccccc1)Oc1ccccc1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LTA4H P09960 4/20 0.43
CA4 P22748 1/20 0.39
TSHR P16473 1/20 0.36
KCNA3 P22001 1/20 0.36
CHRNB2 P17787 2/20 0.35
CHRNB4 P30926 2/20 0.35
CHRNA3 P32297 2/20 0.35
CHRNA7 P36544 2/20 0.35
CHRNA4 P43681 2/20 0.35
RELA Q04206 1/20 0.35
MAPT P10636 1/20 0.35
L3MBTL1 Q9Y468 2/20 0.34
TP53 P04637 2/20 0.34
KDM4E B2RXH2 1/20 0.34
NPC1 O15118 1/20 0.34
ALDH1A1 P00352 1/20 0.34
HPGD P15428 1/20 0.34
RAB9A P51151 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
LMNA P02545 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL766451 0.95 LTA4H (0.43) LTA4HCA4TSHRKCNA3CHRNB2
SCHEMBL5391039 0.95 LTA4H (0.43) LTA4HCA4TSHRKCNA3CHRNB2
SCHEMBL29222960 0.90 LTA4H (0.39) LTA4HCA4TSHRKCNA3CHRNB2
Formaldehyde SCHEMBL28983930 0.90 LTA4H (0.39) LTA4HCA4TSHRKCNA3CHRNB2
SCHEMBL3887627 0.86 LTA4H (0.37) LTA4HCA4TSHRKCNA3CHRNB2
SCHEMBL23494822 0.85 LTA4H (0.39) LTA4HCA4TSHRKCNA3CHRNB2
SCHEMBL25253222 0.85 LTA4H (0.36) LTA4HCA4TSHRCHRNB2CHRNB4
SCHEMBL5405845 0.84 LTA4H (0.42) LTA4HCA4TSHRKCNA3CHRNB2
SCHEMBL5397165 0.84 LTA4H (0.42) LTA4HCA4TSHRKCNA3CHRNB2
SCHEMBL13861932 0.84 RAB9A (0.45) LTA4HCHRNB2CHRNB4CHRNA3CHRNA7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 89 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11912889-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-27 US disclosed
US-20230257503-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE MITSUBISHI CHEMICAL CORPORATION (JP) 2023-08-17 US disclosed
EP-4212256-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE Mitsubishi Chemical Corporation (JP) 2023-07-19 EP disclosed
US-11542397-B2 Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-03 US disclosed
US-11413682-B2 Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid TOKYO OHKA KOGYO CO., LTD. (JP) 2022-08-16 US disclosed
US-20220220338-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-14 US disclosed
US-20220213348-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-07 US disclosed
US-11377522-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica-based coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-05 US disclosed
EP-3971229-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-03-23 EP disclosed
WO-2022054912-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE 三菱ケミカル株式会社 2022-03-17 WO disclosed
US-20060141693-A1 Semiconductor multilayer interconnection forming method TOKYO OHKA KOGYO CO., LTD. (JP) 2006-06-29 US disclosed
EP-1566836-A1 SEMICONDUCTOR MULTILAYER INTERCONNECTION FORMING METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2005-08-24 EP disclosed
US-20050112383-A1 Undercoating layer material for lithography and wiring forming method using the same TOKYO OHKA KOGYO CO., LTD. (JP) 2005-05-26 US disclosed
US-20050074695-A1 Undercoating material for wiring, embedded material, and wiring formation method TOKYO OHKA KOGYO CO., LTD. (JP) 2005-04-07 US disclosed
EP-1413924-A1 COMPOSITION HAVING PERMITIVITY BEING RADIATION-SENSITIVELY CHANGEABLE AND METHOD FOR FORMING PERMITIVITY PATTERN JSR Corporation (JP) 2004-04-28 EP disclosed
US-20040005506-A1 Composition having permitivity being radiation-sensitively changeable and method for forming permitivity pattern JSR CORPORATION (JP) 2004-01-08 US disclosed
EP-1375597-A1 RADIATION-SENSITIVE COMPOSITION CHANGING IN REFRACTIVE INDEX AND UTILIZATION THEREOF JSR Corporation (JP) 2004-01-02 EP disclosed
US-20030171468-A1 Radiation-sensitive composition changing in refractive index and utilization thereof JSR CORPORATION (JP) 2003-09-11 US disclosed
US-5614251-A Method and liquid coating composition for the formation of silica-based coating film on substrate surface TOKYO OHKA KOGYO CO., LTD. (JP) 1997-03-25 US disclosed
US-5496402-A Method and liquid coating composition for the formation of silica-based coating film on substrate surface TOKYO OHKA KOGYO CO, LTD. (JP) 1996-03-05 US disclosed