Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LTA4H | P09960 | 3/20 | 0.42 |
| ▸ | KCNA3 | P22001 | 1/20 | 0.38 |
| ▸ | CHRNB2 | P17787 | 2/20 | 0.37 |
| ▸ | CHRNB4 | P30926 | 2/20 | 0.37 |
| ▸ | CHRNA3 | P32297 | 2/20 | 0.37 |
| ▸ | CHRNA7 | P36544 | 2/20 | 0.37 |
| ▸ | CHRNA4 | P43681 | 2/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.37 |
| ▸ | LMNA | P02545 | 2/20 | 0.37 |
| ▸ | MEN1 | O00255 | 1/20 | 0.37 |
| ▸ | CA4 | P22748 | 1/20 | 0.36 |
| ▸ | HTR1D | P28221 | 1/20 | 0.35 |
| ▸ | HTR1B | P28222 | 1/20 | 0.35 |
| ▸ | MLNR | O43193 | 1/20 | 0.35 |
| ▸ | NR1I2 | O75469 | 1/20 | 0.35 |
| ▸ | ESR1 | P03372 | 1/20 | 0.35 |
| ▸ | NR3C1 | P04150 | 1/20 | 0.35 |
| ▸ | PGR | P06401 | 1/20 | 0.35 |
| ▸ | ADRB2 | P07550 | 1/20 | 0.35 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5034242 | 0.96 | LTA4H (0.42) | LTA4HKCNA3CHRNB2CHRNB4CHRNA3 | |
| SCHEMBL1608841 | 0.96 | LTA4H (0.42) | LTA4HKCNA3CHRNB2CHRNB4CHRNA3 | |
| SCHEMBL1609518 | 0.88 | LTA4H (0.53) | LTA4HKCNA3LMNAMLNRNR1I2 | |
| SCHEMBL26025799 | 0.87 | TAAR1 (0.46) | LTA4HKMT2AMEN1ESR1TAAR1 | |
| SCHEMBL19809310 | 0.87 | LTA4H (0.50) | LTA4HKCNA3LMNAMLNRNR1I2 | |
| SCHEMBL5031012 | 0.84 | LTA4H (0.53) | LTA4HKCNA3LMNAMLNRNR1I2 | |
| SCHEMBL5034225 | 0.84 | LTA4H (0.53) | LTA4HKCNA3LMNAMLNRNR1I2 | |
| SCHEMBL1609097 | 0.83 | LTA4H (0.43) | LTA4HKCNA3CHRNB2CHRNB4CHRNA3 | |
| SCHEMBL4804057 | 0.82 | LTA4H (0.53) | LTA4HKCNA3LMNAMLNRNR1I2 | |
| SCHEMBL11364618 | 0.81 | LTA4H (0.51) | LTA4HKCNA3LMNAMLNRNR1I2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 79 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11912889-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-27 | — | — | US | disclosed |
| US-20230257503-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-08-17 | — | — | US | disclosed |
| EP-4212256-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | Mitsubishi Chemical Corporation (JP) | 2023-07-19 | — | — | EP | disclosed |
| US-11542397-B2 | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-01-03 | — | — | US | disclosed |
| US-11413682-B2 | Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-08-16 | — | — | US | disclosed |
| US-20220220338-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-14 | — | — | US | disclosed |
| US-20220213348-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-07 | — | — | US | disclosed |
| US-11377522-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica-based coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-05 | — | — | US | disclosed |
| EP-3971229-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-03-23 | — | — | EP | disclosed |
| WO-2022054912-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | 三菱ケミカル株式会社 | 2022-03-17 | — | — | WO | disclosed |
| US-20100119939-A1 | NEGATIVE ELECTRODE BASE MEMBER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-05-13 | — | — | US | disclosed |
| EP-2131423-A1 | NEGATIVE ELECTRODE BASE MEMBER | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2009-12-09 | — | — | EP | disclosed |
| EP-1999167-A2 | ZIEGLER-NATTA CATALYST WITH IN SITU-GENERATED DONOR | Novolen Technology Holdings, C.V. (NL) | 2008-12-10 | — | — | EP | disclosed |
| WO-2007106348-A2 | ZIEGLER-NATTA CATALYST WITH IN SITU-GENERATED DONOR | NOVOLEN TECHNOLOGY HOLDINGS C.V. (NL) | 2007-09-20 | — | — | WO | disclosed |
| US-20070213204-A1 | Ziegler-Natta catalyst with in situ-generated donor | NOVOLEN TECHNOLOGY HOLDINGS C.V. | 2007-09-13 | — | — | US | disclosed |
| US-7238462-B2 | Undercoating material for wiring, embedded material, and wiring formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-07-03 | — | — | US | disclosed |
| US-20060141693-A1 | Semiconductor multilayer interconnection forming method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-06-29 | — | — | US | disclosed |
| EP-1566836-A1 | SEMICONDUCTOR MULTILAYER INTERCONNECTION FORMING METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-08-24 | — | — | EP | disclosed |
| US-20050112383-A1 | Undercoating layer material for lithography and wiring forming method using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-05-26 | — | — | US | disclosed |
| US-20050074695-A1 | Undercoating material for wiring, embedded material, and wiring formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-04-07 | — | — | US | disclosed |