⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14481090 | 0.81 | LPAR1 (0.32) | — | |
| SCHEMBL1142694 | 0.79 | — | — | |
| SCHEMBL5918684 | 0.78 | — | — | |
| SCHEMBL1609586 | 0.73 | — | — | |
| SCHEMBL11432693 | 0.72 | FDPS (0.32) | — | |
| SCHEMBL703720 | 0.71 | TSHR (0.32) | — | |
| SCHEMBL22654193 | 0.71 | — | — | |
| SCHEMBL27943194 | 0.69 | TSHR (0.35) | — | |
| SCHEMBL7595313 | 0.68 | — | — | |
| SCHEMBL18506048 | 0.68 | LMNA (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 79 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11912889-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-27 | — | — | US | disclosed |
| US-20230257503-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-08-17 | — | — | US | disclosed |
| EP-4212256-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | Mitsubishi Chemical Corporation (JP) | 2023-07-19 | — | — | EP | disclosed |
| US-11542397-B2 | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-01-03 | — | — | US | disclosed |
| US-11413682-B2 | Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-08-16 | — | — | US | disclosed |
| US-20220220338-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-14 | — | — | US | disclosed |
| US-20220213348-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-07 | — | — | US | disclosed |
| US-11377522-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica-based coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-05 | — | — | US | disclosed |
| EP-3971229-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-03-23 | — | — | EP | disclosed |
| WO-2022054912-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | 三菱ケミカル株式会社 | 2022-03-17 | — | — | WO | disclosed |
| US-20110017291-A1 | DIFFUSING AGENT COMPOSITION FOR INK-JET, AND METHOD FOR PRODUCTION OF ELECTRODE OR SOLAR BATTERY USING THE COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2011-01-27 | — | — | US | disclosed |
| US-20100248477-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating a substrate therewith | YOKOI SHIGERU | 2010-09-30 | — | — | US | disclosed |
| US-20100119939-A1 | NEGATIVE ELECTRODE BASE MEMBER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-05-13 | — | — | US | disclosed |
| US-20100051582-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | YOKOI SHIGERU | 2010-03-04 | — | — | US | disclosed |
| EP-2131423-A1 | NEGATIVE ELECTRODE BASE MEMBER | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2009-12-09 | — | — | EP | disclosed |
| US-20090156005-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | YOKOI SHIGERU | 2009-06-18 | — | — | US | disclosed |
| US-20080318165-A1 | Composition For Forming Antireflective Film And Wiring Forming Method Using Same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-12-25 | — | — | US | disclosed |
| US-20060241012-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | YOKOI SHIGERU | 2006-10-26 | — | — | US | disclosed |
| US-20050112383-A1 | Undercoating layer material for lithography and wiring forming method using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-05-26 | — | — | US | disclosed |
| US-20040121937-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-06-24 | — | — | US | disclosed |