SCHEMBL16124199

SCHEMBL16124199

CCC(C)C(C)(C)OC(=O)C(C)C

nearest known ligand 0.35

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
MMP8 P22894 1/20 0.31
CYP3A4 P08684 2/20 0.30
CYP1A2 P05177 1/20 0.30
CYP2D6 P10635 1/20 0.30
CYP2C9 P11712 1/20 0.30
NFKB1 P19838 1/20 0.30
CYP2C19 P33261 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9768848 0.83 CA1 (0.33) CA1CA2CYP3A4NFKB1
SCHEMBL14991255 0.82 ALDH1A1 (0.31) CYP2D6
SCHEMBL167276 0.82
SCHEMBL19115402 0.81 POLB (0.32) CA1CA2MMP8
SCHEMBL16124310 0.80 GAA (0.41) CYP2D6CYP2C9CYP2C19
SCHEMBL987657 0.79 CHRM1 (0.38) CA1CA2
SCHEMBL9608673 0.79 ELANE (0.31)
SCHEMBL14685290 0.78 KCNH2 (0.37) CYP2D6
SCHEMBL11205840 0.78 CYP2D6 (0.32) CYP2D6
SCHEMBL27477536 0.78 ALOX15 (0.36) CA1CA2CYP3A4CYP1A2CYP2D6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9291892-B2 Actinic ray-sensitive or radiation-sensitive resin composition, and, resist film, pattern forming method, electronic device manufacturing method, and electronic device, each using the composition FUJIFILM CORPORATION (JP) 2016-03-22 US disclosed
US-20150293446-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE COMPOSITION, RESIST FILM USING THE SAME, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2015-10-15 US disclosed
US-20140287363-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND, RESIST FILM, PATTERN FORMING METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELECTRONIC DEVICE, EACH USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2014-09-25 US disclosed