SCHEMBL1614466

SCHEMBL1614466

CC(=COCCOCCOCCO)C(=O)Oc1ccccc1

nearest known ligand 0.38

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.38
RECQL P46063 1/20 0.38
SMN1; SMN2 Q16637 3/20 0.36
KDM4E B2RXH2 2/20 0.36
L3MBTL1 Q9Y468 2/20 0.36
TDP1 Q9NUW8 1/20 0.36
ELANE P08246 2/20 0.35
LMNA P02545 2/20 0.34
GAA P10253 2/20 0.34
MTNR1A P48039 1/20 0.34
MTNR1B P49286 1/20 0.34
MAPT P10636 3/20 0.33
KMT2A Q03164 2/20 0.33
MEN1 O00255 1/20 0.33
NR4A2 P43354 1/20 0.32
HSP90AA1 P07900 1/20 0.32
PTK2B Q14289 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14482005 1.00 ALDH1A1 (0.38) ALDH1A1RECQLSMN1; SMN2KDM4EL3MBTL1
SCHEMBL1614159 1.00 ALDH1A1 (0.38) ALDH1A1RECQLSMN1; SMN2KDM4EL3MBTL1
SCHEMBL14482977 1.00 ALDH1A1 (0.38) ALDH1A1RECQLSMN1; SMN2KDM4EL3MBTL1
SCHEMBL1614290 1.00 ALDH1A1 (0.38) ALDH1A1RECQLSMN1; SMN2KDM4EL3MBTL1
SCHEMBL5440629 0.91 ALDH1A1 (0.42) ALDH1A1RECQLSMN1; SMN2KDM4EL3MBTL1
SCHEMBL9750806 0.82 KMT2A (0.41) ALDH1A1SMN1; SMN2L3MBTL1ELANELMNA
SCHEMBL2344515 0.81 MAPT (0.42) ALDH1A1KDM4EL3MBTL1TDP1ELANE
SCHEMBL31619365 0.80 FAAH (0.45) RECQLL3MBTL1TDP1ELANE
SCHEMBL4412849 0.79 KDM4E (0.46) ALDH1A1SMN1; SMN2KDM4EL3MBTL1TDP1
Di(Hydroxyethyl)Ether SCHEMBL10489041 0.78 ELANE (0.58) ALDH1A1RECQLSMN1; SMN2L3MBTL1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240061334-A1 SOLDER RESIST COMPOSITION, DRY FILM, PRINTED WIRING BOARD, AND METHODS FOR MANUFACTURING SAME TAIYO INK MFG. CO., (KOREA) LTD. (KR) 2024-02-22 US disclosed
US-8178279-B2 Negative radiation-sensitive resin composition JSR CORPORATION (JP) 2012-05-15 US disclosed
US-20110086938-A1 NEGATIVE RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2011-04-14 US disclosed
EP-0650954-B1 Novel lactone-modified diketene(meth)acrylate compound, a process for the preparation thereof, and a (co)polymer DAICEL CHEM (JP) 1998-04-22 EP disclosed
US-5631342-A CURABLE, ADHESIVES, INKS, COATINGS, REACTION PRODUCT OF HYDROXYETHYL METHACRYLATE, KETENE AND LACTONE OR POLYLACTONE, ACTIVE METHYLENE GROUP DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1997-05-20 US disclosed
US-5516933-A Lactone-modified diketene(meth)acrylate compound, a process for the preparation thereof, and a (co)polymer DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1996-05-14 US disclosed
EP-0650954-A1 Novel lactone-modified diketene(meth)acrylate compound, a process for the preparation thereof, and a (co)polymer DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1995-05-03 EP disclosed