SCHEMBL1617649

SCHEMBL1617649

CC=CO[Si](CCCC)(OC=CC)OC=CC

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7700957 0.79
SCHEMBL7700964 0.79
SCHEMBL6245882 0.74
SCHEMBL11260970 0.73
SCHEMBL3362523 0.70 LMNA (0.36) LMNA
SCHEMBL1616281 0.70
SCHEMBL1695902 0.67 LMNA (0.34) LMNA
SCHEMBL56908 0.66 LMNA (0.58) LMNA
SCHEMBL8926195 0.65
SCHEMBL25404161 0.65 LMNA (0.30) LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2020246434-A1 ANTIFOULING COATING COMPOSITION 日東化成株式会社 2020-12-10 WO disclosed
WO-2020209208-A1 ANTIFOULING COATING COMPOSITION 日東化成株式会社 2020-10-15 WO disclosed
US-10336888-B2 Surface-treated calcium carbonate filler for curable resin composition, and curable resin composition containing filler MARUO CALCIUM CO., LTD. (JP) 2019-07-02 US disclosed
US-10179840-B2 Condensation curable resin composition and semiconductor package SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-01-15 US disclosed
EP-3239247-B1 CONDENSATION CURABLE RESIN COMPOSITION AND SEMICONDUCTOR PACKAGE SHINETSU CHEMICAL CO (JP) 2018-07-18 EP disclosed
US-20180016421-A1 SURFACE-TREATED CALCIUM CARBONATE FILLER FOR CURABLE RESIN COMPOSITION, AND CURABLE RESIN COMPOSITION CONTAINING FILLER MARUO CALCIUM CO., LTD. (JP) 2018-01-18 US disclosed
EP-3239247-A1 CONDENSATION CURABLE RESIN COMPOSITION AND SEMICONDUCTOR PACKAGE Shin-Etsu Chemical Co., Ltd. (JP) 2017-11-01 EP disclosed
US-20170306098-A1 CONDENSATION CURABLE RESIN COMPOSITION AND SEMICONDUCTOR PACKAGE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-10-26 US disclosed
US-9422419-B2 Surface-treated calcium carbonate filler, and curable resin composition containing the filler MARUO CALCIUM CO., LTD. (JP) 2016-08-23 US disclosed
US-20150112009-A1 SURFACE-TREATED CALCIUM CARBONATE FILLER, AND CURABLE RESIN COMPOSITION CONTAINING THE FILLER MARUO CALCIUM CO., LTD. (JP) 2015-04-23 US disclosed
EP-2848654-A1 SURFACE-TREATED CALCIUM CARBONATE FILLER, AND CURABLE RESIN COMPOSITION CONTAINING SAID FILLER Maruo Calcium Co., Ltd. (JP) 2015-03-18 EP disclosed
US-7923522-B2 excellent in stability of particle size and to be used for electronic materials; adding a hydrolyzable silane compound SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-04-12 US disclosed
US-20080248280-A1 Process for Preparing a Dispersion Liquid of Zeolite Fine Particles SHIN-ETSU CHEMICAL CO., LTD. 2008-10-09 US disclosed