Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL16192514

CCCCC(CC)CC(CC(=O)O)(CC(CC)CCCC)C(=O)O.N

nearest known ligand 0.46

Full drug profile on Sugi Atlas →

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
CA2 P00918 4/20 0.46
ALDH1A1 P00352 3/20 0.41
HSPD1 P10809 1/20 0.40
BLM P54132 1/20 0.40
HSPE1 P61604 1/20 0.40
TSHR P16473 3/20 0.39
CYP3A4 P08684 3/20 0.39
TDP1 Q9NUW8 2/20 0.39
ATM Q13315 1/20 0.39
MAPK1 P28482 1/20 0.39
L3MBTL1 Q9Y468 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ammonia Solution, Strong SCHEMBL16192510 1.00 CA2 (0.46) CA2ALDH1A1HSPD1BLMHSPE1
SCHEMBL44319 0.98 CA2 (0.47) CA2ALDH1A1HSPD1BLMHSPE1
SCHEMBL2802518 0.97 CA2 (0.46) CA2ALDH1A1HSPD1BLMHSPE1
SCHEMBL430002 0.85 HSPD1 (0.51) HSPD1BLMHSPE1
SCHEMBL11355584 0.84 CA2 (0.50) CA2ALDH1A1TSHRCYP3A4TDP1
SCHEMBL3740917 0.84 CYP2D6 (0.39) ALDH1A1HSPD1BLMHSPE1TSHR
SCHEMBL15577120 0.83 HSPD1 (0.46) HSPD1BLMHSPE1
SCHEMBL5157975 0.83 CA2 (0.49) CA2ALDH1A1TSHRCYP3A4TDP1
SCHEMBL17241161 0.83 CA2 (0.42) CA2ALDH1A1HSPD1BLMHSPE1
SCHEMBL1702351 0.82 CA2 (0.49) CA2ALDH1A1TSHRCYP3A4TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3263612-B1 POLYMER POWDER, CURABLE RESIN COMPOSITION AND CURED MATERIAL THEREOF MITSUBISHI CHEM CORP (JP) 2020-08-05 EP disclosed
EP-3263612-A1 POLYMER POWDER, CURABLE RESIN COMPOSITION AND CURED MATERIAL THEREOF Mitsubishi Chemical Corporation (JP) 2018-01-03 EP disclosed
EP-2796482-B1 POLYMER POWDER, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF MITSUBISHI CHEM CORP (JP) 2017-09-13 EP disclosed
US-9522997-B2 Polymer powder, curable resin composition and cured material thereof MITSUBISHI RAYON CO., LTD. (JP) 2016-12-20 US disclosed
US-20160096955-A1 Polymer Powder, Curable Resin Composition and Cured Material Thereof MITSUBISHI RAYON CO., LTD. (JP) 2016-04-07 US disclosed
US-9193812-B2 Polymer powder, curable resin composition and cured material thereof MITSUBISHI RAYON CO., LTD. (JP) 2015-11-24 US disclosed
US-20140350186-A1 Polymer Powder, Curable Resin Composition and Cured Material Thereof MITSUBISHI RAYON CO., LTD. (JP) 2014-11-27 US disclosed
EP-2796482-A1 POLYMER POWDER, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF Mitsubishi Rayon Co., Ltd. (JP) 2014-10-29 EP disclosed