SCHEMBL16200780

SCHEMBL16200780

CCC(CC(CC(CC(CC(C)c1ccc(O)cc1)c1ccc(O)cc1)c1ccc(O)cc1)c1ccc(O)cc1)c1ccc(O)cc1

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 11/20 0.55
ESR2 Q92731 9/20 0.55
LMNA P02545 1/20 0.48
CYP1A2 P05177 1/20 0.48
PGR P06401 1/20 0.48
CHRM2 P08172 1/20 0.48
CYP3A4 P08684 1/20 0.48
ADORA3 P0DMS8 1/20 0.48
AR P10275 1/20 0.48
CYP2D6 P10635 1/20 0.48
MAPT P10636 1/20 0.48
CHRM1 P11229 1/20 0.48
CYP2C9 P11712 1/20 0.48
ALOX15 P16050 1/20 0.48
DRD1 P21728 1/20 0.48
TBXA2R P21731 1/20 0.48
PTGS1 P23219 1/20 0.48
SLC6A2 P23975 1/20 0.48
CYP2C19 P33261 1/20 0.48
ADRA1A P35348 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16200764 1.00 ESR1 (0.55) ESR1ESR2LMNACYP1A2PGR
SCHEMBL16200769 1.00 ESR1 (0.55) ESR1ESR2LMNACYP1A2PGR
SCHEMBL16865915 1.00 ESR1 (0.55) ESR1ESR2LMNACYP1A2PGR
SCHEMBL13294722 1.00 ESR1 (0.55) ESR1ESR2LMNACYP1A2PGR
SCHEMBL12384051 0.96 ESR1 (0.58) ESR1ESR2LMNACYP1A2PGR
SCHEMBL4435322 0.90 ESR1 (0.57) ESR1ESR2LMNACYP1A2PGR
SCHEMBL5607945 0.90 ESR1 (0.64) ESR1ESR2LMNACYP1A2PGR
SCHEMBL17805783 0.89 TRPA1 (0.53) ESR1ESR2LMNACYP1A2PGR
SCHEMBL15896656 0.89 ESR1 (0.51) ESR1ESR2LMNACYP1A2PGR
SCHEMBL12892720 0.89 TRPA1 (0.53) ESR1ESR2LMNACYP1A2PGR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230139240-A1 RESIN COMPOSITION AND FILM TOPPAN INC. (JP) 2023-05-04 US disclosed
US-20180120705-A1 PATTERN FORMING METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD FUJIFILM CORPORATION (JP) 2018-05-03 US disclosed
US-9448477-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, manufacturing method of electronic device using the same, and electronic device FUJIFILM CORPORATION (JP) 2016-09-20 US disclosed
US-20150185612-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THE SAME, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2015-07-02 US disclosed
US-20140322914-A1 GAP EMBEDDING COMPOSITION, METHOD OF EMBEDDING GAP AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE BY USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2014-10-30 US disclosed