SCHEMBL16237121

SCHEMBL16237121

CCOc1c(-c2ccccc2)oc2cccc(OCC)c2c1=O

nearest known ligand 0.75

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ADORA3 P0DMS8 6/20 0.75
PPARG P37231 1/20 0.53
ACE2 Q9BYF1 1/20 0.50
KDM4E B2RXH2 2/20 0.48
GAA P10253 1/20 0.48
POLH Q9Y253 1/20 0.47
ABCG2 Q9UNQ0 2/20 0.47
KCNA3 P22001 1/20 0.47
MEN1 O00255 1/20 0.47
MAPT P10636 1/20 0.47
PABPC1 P11940 1/20 0.47
KMT2A Q03164 1/20 0.47
TDP1 Q9NUW8 1/20 0.47
CYP2A6 P11509 1/20 0.47
HPGD P15428 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1664326 0.88 ADORA3 (0.70) ADORA3PPARGACE2KDM4EGAA
SCHEMBL30741225 0.86 ADORA3 (1.00) ADORA3PPARGACE2KDM4EPOLH
SCHEMBL1663784 0.86 ADORA3 (1.00) ADORA3PPARGACE2KDM4EPOLH
SCHEMBL3710678 0.84 ADORA3 (0.65) ADORA3PPARGACE2KDM4EGAA
SCHEMBL1483627 0.82 PPARG (0.67) ADORA3PPARGKDM4EGAAABCG2
SCHEMBL7458770 0.81 ABCG2 (0.70) ADORA3KDM4EGAAABCG2KCNA3
SCHEMBL27696055 0.80 ADORA3 (0.50) ADORA3KDM4EGAAABCG2MEN1
SCHEMBL30375357 0.79 PPARG (0.77) ADORA3PPARGKDM4EGAAABCG2
SCHEMBL3701416 0.79 ADORA3 (0.58) ADORA3PPARGACE2KDM4EGAA
SCHEMBL380907 0.78 ADORA3 (0.73) ADORA3PPARGKDM4EABCG2MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116096827-B UV/moisture dual cure composition with enhanced substrate adhesion 美国陶氏有机硅公司 2024-07-12 CN disclosed
CN-116529328-A Method for preparing film and composition therefor 美国陶氏有机硅公司 2023-08-01 CN disclosed
CN-116096827-A UV/moisture dual cure composition with enhanced substrate adhesion 美国陶氏有机硅公司 2023-05-09 CN disclosed
EP-2999467-B1 USE OF A COMBINATION OF TWO COMPOUNDS FOR THE TREATMENT AND/OR PREVENTION OF BONE DISORDERS INST NAT DE LA RECH AGRONOMIQUE INRA (FR) 2020-01-08 EP disclosed
EP-2999467-A1 USE OF A COMBINATION OF TWO COMPOUNDS FOR THE TREATMENT AND/OR PREVENTION OF BONE DISORDERS Institut National De La Recherche Agronomique (INRA) (FR) 2016-03-30 EP disclosed
WO-2014184484-A1 USE OF A COMBINATION OF TWO COMPOUNDS FOR THE TREATMENT AND/OR PREVENTION OF BONE DISORDERS INSTITUT NATIONAL DE LA RECHERCHE AGRONOMIQUE - INRA (FR) 2014-11-20 WO disclosed