SCHEMBL16247999

SCHEMBL16247999

CC1=C(C)C2OC1C1C(=O)OC(=O)C21

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KDM4E B2RXH2 2/20 0.42
▸ TP53 P04637 2/20 0.42
▸ GMNN O75496 1/20 0.42
▸ PPM1B O75688 1/20 0.42
▸ LMNA P02545 1/20 0.42
▸ PPP1CC P36873 1/20 0.42
▸ TFPI2 P48307 1/20 0.42
▸ RAB9A P51151 1/20 0.42
▸ PPP5C P53041 1/20 0.42
▸ PPP1CA P62136 1/20 0.42
▸ PMP22 Q01453 1/20 0.42
▸ SMN1; SMN2 Q16637 1/20 0.42
▸ TDP1 Q9NUW8 1/20 0.42
▸ CYP2D6 P10635 1/20 0.42
▸ NFKB1 P19838 1/20 0.42
▸ THPO P40225 1/20 0.42
▸ MAPT P10636 2/20 0.34
▸ MAPK1 P28482 1/20 0.34
▸ CYP2C19 P33261 1/20 0.34
▸ HSD17B10 Q99714 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4570302 0.80 KDM4E (0.48) KDM4ETP53GMNNPPM1BLMNA
SCHEMBL9742396 0.72 KDM4E (0.41) KDM4ETP53GMNNPPM1BLMNA
SCHEMBL4540344 0.70 — —
SCHEMBL10329439 0.70 KDM4E (0.41) KDM4ETP53GMNNPPM1BLMNA
SCHEMBL112827 0.69 KDM4E (0.53) KDM4ETP53GMNNPPM1BLMNA
SCHEMBL16923832 0.69 KDM4E (0.53) KDM4ETP53GMNNPPM1BLMNA
SCHEMBL21999910 0.69 KDM4E (0.53) KDM4ETP53GMNNPPM1BLMNA
SCHEMBL19107418 0.69 KDM4E (0.53) KDM4ETP53GMNNPPM1BLMNA
SCHEMBL910480 0.69 KDM4E (0.53) KDM4ETP53GMNNPPM1BLMNA
SCHEMBL17916071 0.69 KDM4E (0.53) KDM4ETP53GMNNPPM1BLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11782344-B2 Photosensitive polyimide compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2023-10-10 — — US disclosed
US-11782344-B2 Photosensitive polyimide compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2023-10-10 — — US disclosed
EP-3286605-B1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MAT USA INC (US) 2023-06-28 — — EP disclosed
EP-3286606-B1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MAT USA INC (US) 2022-12-28 — — EP disclosed
EP-2997075-B1 NOVEL POLYMER AND THERMOSETTING COMPOSITION CONTAINING SAME FUJIFILM ELECTRONIC MAT USA INC (US) 2021-12-15 — — EP disclosed
US-20200218152-A1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2020-07-09 — — US disclosed
US-10604628-B2 Polymer and thermosetting composition containing same FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2020-03-31 — — US disclosed
US-20190171105-A1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2019-06-06 — — US disclosed
US-10036952-B2 Photosensitive polyimide compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2018-07-31 — — US disclosed
US-10036952-B2 Photosensitive polyimide compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2018-07-31 — — US disclosed
US-20170260330-A1 Novel Polymer and Thermosetting Composition Containing Same FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2017-09-14 — — US disclosed
US-20170260330-A1 Novel Polymer and Thermosetting Composition Containing Same FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2017-09-14 — — US disclosed
US-9695284-B2 Polymer and thermosetting composition containing same FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2017-07-04 — — US disclosed
US-9695284-B2 Polymer and thermosetting composition containing same FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2017-07-04 — — US disclosed
US-20160313641-A1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2016-10-27 — — US disclosed
US-20160313642-A1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2016-10-27 — — US disclosed
US-20160313642-A1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2016-10-27 — — US disclosed
US-20160313641-A1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2016-10-27 — — US disclosed
US-20140343199-A1 Novel Polymer and Thermosetting Composition Containing Same FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2014-11-20 — — US disclosed
US-20140343199-A1 Novel Polymer and Thermosetting Composition Containing Same FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2014-11-20 — — US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20170260330-A1 Novel Polymer and Thermosetting Composition Containing Same INO80C, INCENP, PUF60 KDM4E 788/4885TP53 2219/4885GMNN 1208/4885
US-10604628-B2 Polymer and thermosetting composition containing same PARG, INO80C, INCENP KDM4E 813/4885TP53 2409/4885GMNN 1146/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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