SCHEMBL1627410

SCHEMBL1627410

CCCCCCC(O)CC=C(C)C(=O)O

nearest known ligand 0.53

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 8/20 0.53
FFAR1 O14842 3/20 0.51
FFAR4 Q5NUL3 2/20 0.51
LCK P06239 1/20 0.46
PPARD Q03181 1/20 0.46
ZDHHC20 Q5W0Z9 1/20 0.46
ZDHHC2 Q9UIJ5 1/20 0.46
FAAH O00519 4/20 0.45
NFKB1 P19838 1/20 0.42
MAPT P10636 1/20 0.42
EP300 Q09472 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14245019 1.00 GPR84 (0.53) GPR84FFAR1FFAR4LCKPPARD
SCHEMBL26980104 1.00 GPR84 (0.53) GPR84FFAR1FFAR4LCKPPARD
SCHEMBL1627407 1.00 GPR84 (0.53) GPR84FFAR1FFAR4LCKPPARD
SCHEMBL6063799 1.00 GPR84 (0.53) GPR84FFAR1FFAR4LCKPPARD
SCHEMBL613229 0.93 GPR84 (0.43) GPR84FFAR1FFAR4LCKPPARD
SCHEMBL12076392 0.93 GPR84 (0.43) GPR84FFAR1FFAR4LCKPPARD
SCHEMBL1353707 0.85 CHRM1 (0.37) GPR84FFAR1FFAR4LCKPPARD
SCHEMBL10909635 0.85 CHRM1 (0.37) GPR84FFAR1FFAR4LCKPPARD
SCHEMBL10593186 0.85 FFAR1 (0.54) GPR84FFAR1FFAR4LCKPPARD
SCHEMBL10593196 0.85 FFAR1 (0.54) GPR84FFAR1FFAR4LCKPPARD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20110117332-A1 ACRYLATE RESIN, PHOTORESIST COMPOSITION COMPRISING THE SAME, AND PHOTORESIST PATTERN LG CHEM. LTD. (KR) 2011-05-19 US claimed
US-7927781-B2 Photosensitive resin composition, method for preparing the same, and dry film resist comprising the same DONGJIN SEMICHEM CO., LTD. (KR) 2011-04-19 US claimed
US-20090136872-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PREPARING THE SAME, AND DRY FILM RESIST COMPRISING THE SAME DONGJIN SEMICHEM CO., LTD. (KR) 2009-05-28 US claimed
WO-2008060078-A1 OPTICAL FILTER FOR DISPLAY PANEL AND METHOD OF MANUFACTURING SAME DONGJIN SEMICHEM CO., LTD. (KR) 2008-05-22 WO claimed
WO-2007123324-A1 PASTE COMPOSITION FOR PRINTING DONGJIN SEMICHEM CO., LTD (KR) 2007-11-01 WO claimed
WO-2007119955-A1 PASTE COMPOSITION FOR PRINTING DONGJIN SEMICHEM CO., LTD (KR) 2007-10-25 WO claimed
US-20060141392-A1 Photosensitive resin composition, method for preparing the same, and dry film resist comprising the same DONGJIN SEMICHEM CO., LTD. (KR) 2006-06-29 US claimed
US-20110117332-A1 ACRYLATE RESIN, PHOTORESIST COMPOSITION COMPRISING THE SAME, AND PHOTORESIST PATTERN LG CHEM. LTD. (KR) 2011-05-19 US disclosed
US-7927781-B2 Photosensitive resin composition, method for preparing the same, and dry film resist comprising the same DONGJIN SEMICHEM CO., LTD. (KR) 2011-04-19 US disclosed
US-7763402-B2 Photosensitive resin composition DONGJIN SEMICHEM CO., LTD. (KR) 2010-07-27 US disclosed
US-20090136872-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PREPARING THE SAME, AND DRY FILM RESIST COMPRISING THE SAME DONGJIN SEMICHEM CO., LTD. (KR) 2009-05-28 US disclosed
US-20080051483-A1 PHOTOSENSITIVE RESIN COMPOSITION DONGJIN SEMICHEM CO., LTD. (KR) 2008-02-28 US disclosed
US-7335718-B2 Polyester oligomers DSM IP ASSETS B.V. (NL) 2008-02-26 US disclosed
US-20060011895-A1 Pb free Ag paste composition for PDP address electrode DONGJIN SEMICHEM CO., LTD. (KR) 2006-01-19 US disclosed
EP-1572775-A1 POLYESTER OLIGOMERS DSM IP Assets B.V. (NL) 2005-09-14 EP disclosed
US-20040209994-A1 Polyester oligomers DSM IP ASSETS B.V. (NL) 2004-10-21 US disclosed
WO-2004072736-A1 AG PASTE COMPOSITION FOR MICROELECTRODE FORMATION AND MICROELECTRODE FORMED USING THE SAME DONGJIN SEMICHEM CO. LTD. (KR) 2004-08-26 WO disclosed
WO-2004056902-A1 POLYESTER OLIGOMERS DSM IP ASSETS B.V. (NL) 2004-07-08 WO disclosed
US-20030195271-A1 Coated optical fiber and radiation-curable resin composition DSM N.V. AND JSR CORPORATION 2003-10-16 US disclosed
US-6579618-B1 Optical fiber comprising coating obtained by curing composition including polymer with urethane bonds in chain and unsaturated groups, monomer having two or three unsaturated groups, monomer having one acryloyl group, initiator DSM N.V. (NL) 2003-06-17 US disclosed