SCHEMBL1628830

SCHEMBL1628830

C=CCC(C=C)C=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9450642 0.88
SCHEMBL216833 0.81
Phosphine SCHEMBL7669078 0.78
SCHEMBL8960064 0.74
SCHEMBL6712229 0.74
SCHEMBL38438 0.71
SCHEMBL25135488 0.69
SCHEMBL28810042 0.69
SCHEMBL3724075 0.67
SCHEMBL9282902 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 240 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2615117-B2 WATER ABSORBENT RESIN AND METHOD FOR PRODUCING SAME SUMITOMO SEIKA CHEMICALS (JP) 2023-12-27 EP claimed
EP-2615117-B1 WATER ABSORBENT RESIN AND METHOD FOR PRODUCING SAME SUMITOMO SEIKA CHEMICALS (JP) 2021-03-17 EP claimed
US-8198376-B2 Process for production of water-absorbable resin SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) 2012-06-12 US claimed
EP-2615117-B2 WATER ABSORBENT RESIN AND METHOD FOR PRODUCING SAME SUMITOMO SEIKA CHEMICALS (JP) 2023-12-27 EP disclosed
CN-111902581-B Sandbag and manufacturing method thereof 住友精化株式会社 2023-02-03 CN disclosed
CN-111902117-B Absorbent article 住友精化株式会社 2022-12-27 CN disclosed
WO-2022255220-A1 PROCESSING SOLUTION, METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT 富士フイルム株式会社 2022-12-08 WO disclosed
CN-115443311-A Particulate water-absorbent resin composition, method for producing same, absorbent body, and absorbent article 住友精化株式会社 2022-12-06 CN disclosed
CN-115443312-A Water-absorbent resin composition, absorbent body, and absorbent article 住友精化株式会社 2022-12-06 CN disclosed
CN-115279316-A Water-absorbent sheet and absorbent article 住友精化株式会社 2022-11-01 CN disclosed
CN-110446727-B Water-absorbent resin particles 住友精化株式会社 2022-08-26 CN disclosed
EP-0732218-A1 Ink-receiving layers for ink-jet recording elements AGFA-GEVAERT N.V. (BE) 1996-09-18 EP disclosed
EP-0704314-A1 Ink jet printing system AGFA-GEVAERT N.V. (BE) 1996-04-03 EP disclosed
EP-0701902-A1 Ink image-receiving element AGFA-GEVAERT N.V. (BE) 1996-03-20 EP disclosed
US-5418078-A Coating of binder and polymer with phosphonium containing monomer as mordanting agent; waterfastness AGFA-GEVAERT, N.V. (BE) 1995-05-23 US disclosed
EP-0609930-A1 Ink-receiving layers AGFA-GEVAERT N.V. (BE) 1994-08-10 EP disclosed
EP-0594896-A1 Ink-receptive layers AGFA-GEVAERT N.V. (BE) 1994-05-04 EP disclosed
EP-0355752-B1 Recording medium CANON KK (JP) 1994-03-09 EP disclosed
US-5059983-A Containing acetylene oxide or glycol CANON KABUSHIKI KAISHA (JP) 1991-10-22 US disclosed
US-4704477-A Trimethylcyclohexene derivatives, their preparation and use as perfume substances CONSORTIUM FUR ELEKTROCHEMISCHE INDUSTRIE GMBH (DE) 1987-11-03 US disclosed