SCHEMBL216833

SCHEMBL216833

C=CCC(C=C)C=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phosphine SCHEMBL7669078 0.96
SCHEMBL1628830 0.81
SCHEMBL395365 0.76
SCHEMBL9450642 0.72
SCHEMBL9059143 0.69
SCHEMBL87335 0.67 TSHR (0.33)
SCHEMBL11191915 0.67 TSHR (0.33)
SCHEMBL10745017 0.67
SCHEMBL6014028 0.67
SCHEMBL21953486 0.65 TSHR (0.36)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 148 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4429039-A SUBBING LAYER CONTAINING AN ADDITION COPOLYMER AND A DICHLORO-2-TRIAZINE DERIVATIVE FUJI PHOTO FILM CO., LTD. (JP) 1984-01-31 US claimed
US-4265946-A Process for forming a subbing layer on a plastic support FUJI PHOTO FILM CO., LTD. (JP) 1981-05-05 US claimed
US-12637604-B2 Silicon-containing thermally conductive pastes WACKER CHEMIE AG (DE) 2026-05-26 US disclosed
US-12290981-B2 3D printing apparatus for layer-by-layer fabrication of objects using layer transfer printing WACKER CHEMIE AG (DE) 2025-05-06 US disclosed
US-20250019585-A1 ALUMINUM-CONTAINING THERMAL PASTES WACKER CHEMIE AG (DE) 2025-01-16 US disclosed
US-20240417582-A1 ELECTRICALLY CONDUCTIVE SILICONE COMPOSITION WITH CARBON NANOTUBES AND CARBON BLACK WACKER CHEMIE AG (DE) 2024-12-19 US disclosed
US-20240399021-A1 ANTIMICROBIAL COMPOSITION AND METHOD FOR MAKING THE SAME WACKER CHEMIE AG (DE) 2024-12-05 US disclosed
US-20240309258-A1 SILICON-CONTAINING THERMALLY CONDUCTIVE PASTES WACKER CHEMIE AG (DE) 2024-09-19 US disclosed
CN-118102877-A Antimicrobial compositions and methods of making the same 瓦克化学股份公司 2024-05-28 CN disclosed
CN-118103925-A Conductive silicone composition with carbon nanotubes and carbon black 瓦克化学股份公司 2024-05-28 CN disclosed
CN-114829477-B Optically bonded silicones with UV blockers for outdoor applications 瓦克化学股份公司 2024-04-12 CN disclosed
EP-0982370-A1 Curable polysiloxane compositions Wacker-Chemie GmbH (DE) 2000-03-01 EP disclosed
CN-1229399-A Thermoplastic resin coated ammonium polyphosphate and process for preparation thereof CHISSO CORP (JP) 1999-09-22 CN disclosed
EP-0924166-A1 THERMOPLASTIC-COATED AMMONIUM POLYPHOSPHATE AND PROCESS FOR THE PREPARATION THEREOF CHISSO CORPORATION (JP) 1999-06-23 EP disclosed
US-5705329-A SUPPORT WITH PHOTOGRAPHIC MATERIAL, POLYMER LAYER AND SILVER HALIDE EMULSION LAYER KONICA CORPORATION (JP) 1998-01-06 US disclosed
EP-0706082-A1 A silver halide photographic light-sensitive material KONICA CORPORATION (JP) 1996-04-10 EP disclosed
US-4487802-A SOLVENT-FREE SUBBING LAYER OF A DIENE-VINYL AROMATIC COMPOUND COPOLYMER; ADHESION; TAPES FUJI PHOTO FILM CO., LTD. (JP) 1984-12-11 US disclosed
US-4429039-A SUBBING LAYER CONTAINING AN ADDITION COPOLYMER AND A DICHLORO-2-TRIAZINE DERIVATIVE FUJI PHOTO FILM CO., LTD. (JP) 1984-01-31 US disclosed
US-4265946-A Process for forming a subbing layer on a plastic support FUJI PHOTO FILM CO., LTD. (JP) 1981-05-05 US disclosed
US-4242418-A PHOTOGRAPHIC PAPER COATED WITH COPOLYMER OF A DIENE AND A MONOVINYL AROMATIC, AND POLYOLEFIN FUJI PHOTO FILM CO., LTD. (JP) 1980-12-30 US disclosed