SCHEMBL16314

SCHEMBL16314

[Al+3].[Al+3].[Al+3].[N-3].[N-3].[N-3].[N-3].[N-3].[N-3].[N-3].[Ti+4].[Ti+4].[Ti+4]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16632113 0.87
SCHEMBL14687440 0.87
SCHEMBL16241875 0.87
SCHEMBL566932 0.87
SCHEMBL996453 0.87
SCHEMBL149910 0.87
SCHEMBL15515137 0.87
SCHEMBL16007319 0.87
SCHEMBL1919131 0.87
SCHEMBL9637793 0.87

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 23434 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260150377-A1 SEMICONDUCTOR DEVICE SAMSUNG ELECTRONICS CO., LTD. (KR) 2026-05-28 US claimed
US-20260149428-A1 ACOUSTIC WAVE DEVICE, FILTER, AND MULTIPLEXER TAIYO YUDEN CO., LTD. (JP) 2026-05-28 US claimed
CN-122092819-A Acoustic wave device, filter, and multiplexer 2026-05-26 CN claimed
US-20260143787-A1 CFET STRUCTURE WITH MULTIPLE THRESHOLD VOLTAGES AND METHOD MAKING THE SAME TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TW) 2026-05-21 US claimed
US-20260143975-A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME SK HYNIX INC (KR) 2026-05-21 US claimed
US-12635194-B2 Semiconductor device SAMSUNG ELECTRONICS CO., LTD. (KR) 2026-05-19 US claimed
US-20260136642-A1 Threshold Voltage Tuning Using a Multiple Dipole Loop Process for Monolithic CFET Devices TAIWAN SEMICONDUCTOR MFG (TW) 2026-05-14 US claimed
US-20260136655-A1 GATE-ALL-AROUND FIELD EFFECT TRANSISTOR STRUCTURE Electronics and telecommunications research inst (KR) 2026-05-14 US claimed
EP-4741094-A1 FRICTION STIR WELDING TOOL Hufschmied Zerspanungssysteme GmbH (DE) 2026-05-13 EP claimed
CN-224222875-U Spiral bevel gear tooth top rounding device 长沙斯瑞机械有限公司 2026-05-12 CN claimed
EP-0579756-A1 COATED CUTTING TOOL WARNER-LAMBERT COMPANY (US) 1994-01-26 EP claimed
US-5252360-A Process for the protection of an engraved roll or plate by coating an engraved surface with an interlayer and thereafter applying a wear-resistant layer to the interlayer by PVD HUETTL WOLFGANG (DE) 1993-10-12 US claimed
EP-0305295-B1 METALLIZATION LAYER STRUCTURE FORMED ON ALUMINUM NITRIDE CERAMICS AND METHOD OF PRODUCING THE METALLIZATION LAYER STRUCTURE FUJITSU LIMITED (JP) 1993-04-21 EP claimed
WO-1992017323-A1 COATED CUTTING TOOL WARNER-LAMBERT COMPANY (US) 1992-10-15 WO claimed
US-5096749-A METHOD OF PRODUCING A METALLIZATION LAYER STRUCTURE FUJITSU LIMITED (JP) 1992-03-17 US claimed
US-5071693-A Evaporation, vapor deposition UNION CARBIDE COATINGS SERVICE TECHNOLOGY CORPORATION (US) 1991-12-10 US claimed
EP-0418001-A1 Multilayer coating of a nitride-containing compound and its production Praxair S.T. Technology, Inc. (US) 1991-03-20 EP claimed
US-4980239-A Metallization layer structure formed on aluminum nitride ceramics and method of producing the metallization layer structure FUJITSU LIMITED (JP) 1990-12-25 US claimed
WO-1989002351-A1 SHEARING COMB WATERS GUY EDMOND (AU) 1989-03-23 WO claimed
EP-0305295-A2 Metallization layer structure formed on aluminum nitride ceramics and method of producing the metallization layer structure FUJITSU LIMITED (JP) 1989-03-01 EP claimed