⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1918346 | 0.89 | — | — | |
| SCHEMBL715681 | 0.87 | — | — | |
| SCHEMBL165432 | 0.87 | — | — | |
| SCHEMBL73746 | 0.87 | — | — | |
| SCHEMBL890500 | 0.87 | — | — | |
| SCHEMBL10391969 | 0.87 | — | — | |
| SCHEMBL16314 | 0.87 | — | — | |
| SCHEMBL2219027 | 0.87 | — | — | |
| SCHEMBL9989320 | 0.75 | — | — | |
| SCHEMBL3962334 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114888368-B | Method for improving machining precision of stainless steel CG internal thread | 贵州永红航空机械有限责任公司 | 2023-08-04 | — | — | CN | claimed |
| CN-114888368-B | Method for improving machining precision of stainless steel CG internal thread | 贵州永红航空机械有限责任公司 | 2023-08-04 | — | — | CN | disclosed |
| US-10026607-B2 | Substrate processing apparatus for forming film including at least two different elements | HITACHI KOKUSAI ELECTRIC, INC. (JP) | 2018-07-17 | — | — | US | disclosed |
| US-10020338-B2 | Backside illuminated image sensor | INTELLECTUAL VENTURES II LLC (US) | 2018-07-10 | — | — | US | disclosed |
| US-20170200599-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING APPARATUS FOR FORMING FILM INCLUDING AT LEAST TWO DIFFERENT ELEMENTS | Kokusai Electric Corporation (JP) | 2017-07-13 | — | — | US | disclosed |
| US-9553122-B2 | Backside illuminated image sensor | INTELLECTUAL VENTURES II LLC (US) | 2017-01-24 | — | — | US | disclosed |
| US-20160329208-A1 | SUBSTRATE PROCESSING APPARATUS FOR FORMING FILM INCLUDING AT LEAST TWO DIFFERENT ELEMENTS | Kokusai Electric Corporation (JP) | 2016-11-10 | — | — | US | disclosed |
| US-9487861-B2 | Substrate processing apparatus capable of forming films including at least two different elements | HITACHI KOKUSAI ELECTRIC INC. (JP) | 2016-11-08 | — | — | US | disclosed |
| US-9478417-B2 | Method of manufacturing semiconductor device for forming film including at least two different elements | HITACHI KOKUSAI ELECTRIC INC. (JP) | 2016-10-25 | — | — | US | disclosed |
| US-20160298236-A1 | SUBTRATE PROCESSING APPARATUS CAPABLE FORMING FILM INCLUDING AT LEAST TWO DIFFERENT ELEMENTS | Kokusai Electric Corporation (JP) | 2016-10-13 | — | — | US | disclosed |
| US-8420438-B2 | Backside illuminated image sensor | INTELLECTUAL VENTURES II, LLC (US) | 2013-04-16 | — | — | US | disclosed |
| US-8409988-B2 | Method of manufacturing semiconductor device and substrate processing apparatus | HITACHI KOKUSAI ELECTRIC INC. (JP) | 2013-04-02 | — | — | US | disclosed |
| EP-2565926-A1 | Backside illuminated image sensor | Intellectual Ventures II LLC (US) | 2013-03-06 | — | — | EP | disclosed |
| US-20110294280-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING APPARATUS | HITACHI KOKUSAI ELECTRIC INC. (JP) | 2011-12-01 | — | — | US | disclosed |
| US-20110223707-A1 | Backside Illuminated Image Sensor | INTELLECTUAL VENTURES II LLC | 2011-09-15 | — | — | US | disclosed |
| EP-2361440-A1 | BACKSIDE ILLUMINATED IMAGE SENSOR | Crosstek Capital, LLC (US) | 2011-08-31 | — | — | EP | disclosed |
| US-7875948-B2 | Backside illuminated image sensor | INTELLECTUAL VENTURES II LLC | 2011-01-25 | — | — | US | disclosed |
| US-20100130024-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING APPARATUS | HITACHI-KOKUSAI ELECTRIC INC. (JP) | 2010-05-27 | — | — | US | disclosed |
| WO-2010048291-A1 | BACKSIDE ILLUMINATED IMAGE SENSOR | Crosstek Capital, LLC (US) | 2010-04-29 | — | — | WO | disclosed |
| US-20100096718-A1 | BACKSIDE ILLUMINATED IMAGE SENSOR | INTELLECTUAL VENTURES II LLC | 2010-04-22 | — | — | US | disclosed |