SCHEMBL16330008

SCHEMBL16330008

CCCCOCCCCCC(=O)OCC(COC(=O)C(C)(C)CC)OC(=O)CCC(=O)O

nearest known ligand 0.55

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 1/20 0.55
▸ LMNA P02545 1/20 0.55
▸ LPAR3 Q9UBY5 7/20 0.50
▸ LPAR1 Q92633 4/20 0.50
▸ ENPP2 Q13822 3/20 0.50
▸ SMN1; SMN2 Q16637 1/20 0.50
▸ PRKCA P17252 2/20 0.49
▸ PRKCE Q02156 2/20 0.49
▸ PRKCQ Q04759 2/20 0.49
▸ PRKCD Q05655 2/20 0.49
▸ LPAR2 Q9HBW0 2/20 0.46
▸ TLR2 O60603 2/20 0.46
▸ RECQL P46063 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12452131 0.98 ALDH1A1 (0.53) ALDH1A1LMNALPAR3LPAR1ENPP2
SCHEMBL14998054 0.95 ALDH1A1 (0.51) ALDH1A1LMNALPAR3LPAR1ENPP2
SCHEMBL12625930 0.95 ALDH1A1 (0.51) ALDH1A1LMNALPAR3LPAR1ENPP2
SCHEMBL12452077 0.94 ALDH1A1 (0.56) ALDH1A1LMNALPAR3LPAR1ENPP2
SCHEMBL801902 0.94 ALDH1A1 (0.56) ALDH1A1LMNALPAR3LPAR1ENPP2
SCHEMBL14789193 0.93 ALDH1A1 (0.54) ALDH1A1LMNALPAR3LPAR1ENPP2
SCHEMBL12452122 0.90 ALDH1A1 (0.53) ALDH1A1LMNALPAR3LPAR1ENPP2
SCHEMBL10093757 0.90 ALDH1A1 (0.53) ALDH1A1LMNALPAR3LPAR1ENPP2
SCHEMBL10110603 0.86 ALDH1A1 (0.49) ALDH1A1LMNALPAR3LPAR1ENPP2
SCHEMBL801879 0.83 LPAR1 (0.53) ALDH1A1LMNALPAR3LPAR1ENPP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9389505-B2 Polymerizable composition for solder resist, and solder resist pattern formation method FUJIFILM CORPORATION (JP) 2016-07-12 — — US disclosed
US-20130034812-A1 POLYMERIZABLE COMPOSITION FOR SOLDER RESIST, AND SOLDER RESIST PATTERN FORMATION METHOD FUJIFILM CORPORATION (JP) 2013-02-07 — — US disclosed
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