SCHEMBL801879

SCHEMBL801879

CCCCOCCCCCC(=O)OCC(O)COC(=O)C(C)(C)CC

nearest known ligand 0.53

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
LPAR1 Q92633 8/20 0.53
ENPP2 Q13822 6/20 0.53
LPAR4 Q99677 4/20 0.53
LPAR2 Q9HBW0 4/20 0.53
LPAR3 Q9UBY5 4/20 0.53
LPAR5 Q9H1C0 3/20 0.53
LPAR6 P43657 2/20 0.53
LMNA P02545 2/20 0.52
KDM4E B2RXH2 1/20 0.52
DUSP3 P51452 1/20 0.52
MEN1 O00255 1/20 0.52
KMT2A Q03164 1/20 0.52
MAPT P10636 1/20 0.48
TRPV1 Q8NER1 2/20 0.47
CES2 O00748 1/20 0.47
DGKA P23743 1/20 0.46
ALDH1A1 P00352 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12452124 0.97 LPAR1 (0.51) LPAR1ENPP2LPAR4LPAR2LPAR3
SCHEMBL12452128 0.97 LPAR1 (0.51) LPAR1ENPP2LPAR4LPAR2LPAR3
SCHEMBL801340 0.93 LPAR1 (0.48) LPAR1ENPP2LPAR4LPAR2LPAR3
SCHEMBL12452045 0.92 LPAR1 (0.53) LPAR1ENPP2LPAR4LPAR2LPAR3
SCHEMBL801349 0.92 LPAR1 (0.53) LPAR1ENPP2LPAR4LPAR2LPAR3
SCHEMBL12691517 0.91 LPAR1 (0.58) LPAR1ENPP2LPAR4LPAR2LPAR3
SCHEMBL17084866 0.91 LPAR1 (0.58) LPAR1ENPP2LPAR4LPAR2LPAR3
SCHEMBL10093755 0.88 LPAR1 (0.51) LPAR1ENPP2LPAR4LPAR2LPAR3
SCHEMBL12452121 0.88 LPAR1 (0.51) LPAR1ENPP2LPAR4LPAR2LPAR3
SCHEMBL801865 0.84 ATM (0.46) LPAR1ENPP2LPAR4LPAR2LPAR3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9389507-B2 Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition FUJIFILM CORPORATION (JP) 2016-07-12 US disclosed
US-9389505-B2 Polymerizable composition for solder resist, and solder resist pattern formation method FUJIFILM CORPORATION (JP) 2016-07-12 US disclosed
US-9354514-B2 Photosensitive transparent composition for color filter of solid-state imaging device, and production method of color filter of solid-state imaging device, color filter of solid-state imaging device, and solid-state imaging device, each using the same FUJIFILM CORPORATION (JP) 2016-05-31 US disclosed
US-8908293-B2 Dispersion composition, photosensitive resin composition, and solid-state image pick-up element FUJIFILM CORPORATION (JP) 2014-12-09 US disclosed
US-20140255846-A1 POLYMERIZABLE COMPOSITION, AND PHOTOSENSITIVE LAYER, PERMANENT PATTERN, WAFER-LEVEL LENS, SOLID-STATE IMAGING DEVICE AND PATTERN FORMING METHOD EACH USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2014-09-11 US disclosed
US-8808948-B2 Dispersion composition, photosensitive resin composition for light-shielding color filter, light-shielding color filter, method of producing the same, and solid-state image sensor having the color filter FUJIFILM CORPORATION (JP) 2014-08-19 US disclosed
US-8790852-B2 Colored composition for light-shielding film, light-shielding pattern, method for forming the same, solid-state image sensing device, and method for producing the same FUJIFILM CORPORATION (JP) 2014-07-29 US disclosed
US-8766388-B2 Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition FUJIFILM CORPORATION (JP) 2014-07-01 US disclosed
US-8759741-B2 Titanium black dispersion, photosensitive resin composition, wafer level lens, light blocking film, method for producing the light blocking film, and solid-state image pickup element FUJIFILM CORPORATION (JP) 2014-06-24 US disclosed
US-8735483-B2 Polymerizable composition FUJIFILM CORPORATION (JP) 2014-05-27 US disclosed
US-20130072615-A1 POLYMERIZABLE COMPOSITION FUJIFILM CORPORATION (JP) 2013-03-21 US disclosed
US-20130034812-A1 POLYMERIZABLE COMPOSITION FOR SOLDER RESIST, AND SOLDER RESIST PATTERN FORMATION METHOD FUJIFILM CORPORATION (JP) 2013-02-07 US disclosed
US-20120257283-A1 DISPERSION COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, AND SOLID-STATE IMAGE PICK-UP ELEMENT FUJIFILM CORPORATION (JP) 2012-10-11 US disclosed
US-8278386-B2 Dispersion composition, polymerizable composition, light-shielding color filter, solid-state image pick-up element, liquid crystal display device, wafer level lens, and image pick-up unit FUJIFILM CORPORATION (JP) 2012-10-02 US disclosed
US-20120199727-A1 TITANIUM BLACK DISPERSION, PHOTOSENSITIVE RESIN COMPOSITION, WAFER LEVEL LENS, LIGHT BLOCKING FILM, METHOD FOR PRODUCING THE LIGHT BLOCKING FILM, AND SOLID-STATE IMAGE PICKUP ELEMENT FUJIFILM CORPORATION (JP) 2012-08-09 US disclosed
US-20120104529-A1 COLORED COMPOSITION FOR LIGHT-SHIELDING FILM, LIGHT-SHIELDING PATTERN, METHOD FOR FORMING THE SAME, SOLID-STATE IMAGE SENSING DEVICE, AND METHOD FOR PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2012-05-03 US disclosed
US-20120068292-A1 POLYMERIZABLE COMPOSITION, AND PHOTOSENSITIVE LAYER, PERMANENT PATTERN, WAFER-LEVEL LENS, SOLID-STATE IMAGING DEVICE AND PATTERN FORMING METHOD EACH USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2012-03-22 US disclosed
US-20110217637-A1 POLYMERIZABLE COMPOSITION FOR COLOR FILTER, COLOR FILTER, AND SOLID-STATE IMAGING DEVICE FUJIFILM CORPORATION (JP) 2011-09-08 US disclosed
US-20110124824-A1 DISPERSION COMPOSITION, POLYMERIZABLE COMPOSITION, LIGHT-SHIELDING COLOR FILTER, SOLID-STATE IMAGE PICK-UP ELEMENT, LIQUID CRYSTAL DISPLAY DEVICE, WAFER LEVEL LENS, AND IMAGE PICK-UP UNIT FUJIFILM CORPORATION (JP) 2011-05-26 US disclosed
US-20100209845-A1 DISPERSION COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FOR LIGHT-SHIELDING COLOR FILTER, LIGHT-SHIELDING COLOR FILTER, METHOD OF PRODUCING THE SAME, AND SOLID-STATE IMAGE SENSOR HAVING THE COLOR FILTER FUJIFILM CORPORATION (JP) 2010-08-19 US disclosed