SCHEMBL1634787

SCHEMBL1634787

O=C(O)c1cccc(Oc2ccc(S(=O)(=O)c3ccc(Oc4cccc(C(=O)O)c4)cc3)cc2)c1

nearest known ligand 0.72

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AKR1C3 P42330 2/20 0.72
KDM4E B2RXH2 1/20 0.64
ALDH1A1 P00352 1/20 0.62
KMO O15229 1/20 0.60
L3MBTL1 Q9Y468 2/20 0.60
POLB P06746 2/20 0.60
APEX1 P27695 1/20 0.60
CTDSP1 Q9GZU7 1/20 0.60
HTT P42858 2/20 0.56
TDP1 Q9NUW8 1/20 0.56
NPC1 O15118 1/20 0.56
CYP2C9 P11712 1/20 0.56
RAB9A P51151 1/20 0.56
SMN1; SMN2 Q16637 1/20 0.54
TNKS O95271 1/20 0.53
PARP15 Q460N3 1/20 0.53
PARP14 Q460N5 1/20 0.53
PARP10 Q53GL7 1/20 0.53
TNKS2 Q9H2K2 1/20 0.53
PARP2 Q9UGN5 1/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16429303 0.97 AKR1C3 (0.68) AKR1C3KDM4EALDH1A1KMOL3MBTL1
SCHEMBL1042631 0.88 AKR1C3 (0.92) AKR1C3KDM4EALDH1A1KMOPOLB
SCHEMBL30266789 0.88 AKR1C3 (0.92) AKR1C3KDM4EALDH1A1KMOPOLB
SCHEMBL28928529 0.88 AKR1C3 (0.58) AKR1C3KDM4EALDH1A1L3MBTL1POLB
SCHEMBL30056027 0.88 AKR1C3 (0.58) AKR1C3KDM4EALDH1A1L3MBTL1POLB
SCHEMBL1107731 0.88 AKR1C3 (0.68) AKR1C3KDM4EALDH1A1KMOPOLB
SCHEMBL4320685 0.86 AKR1C3 (0.96) AKR1C3KDM4EKMOPOLBNPC1
SCHEMBL29546656 0.86 AKR1C3 (0.96) AKR1C3KDM4EKMOPOLBNPC1
SCHEMBL28701196 0.86 AKR1C3 (0.96) AKR1C3KDM4EKMOPOLBNPC1
SCHEMBL10496995 0.86 HTT (0.55) AKR1C3KDM4EALDH1A1KMOL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 79 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4864009-A Molding composition consisting of aliphatic/aromatic copolyamide HUELS AKTIENGESELLSCHAFT (DE) 1989-09-05 US claimed
EP-3896114-B1 POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2023-10-18 EP disclosed
CN-116194435-A Fluorine-containing diamine or salt thereof, method for producing fluorine-containing diamine or salt thereof, polyamide, method for producing polyamide, polyamide solution, polyamide cyclized body, method for producing polyamide cyclized body, insulating material for high-frequency electronic component, method for producing insulating material for high-frequency electronic component, high-frequency machine, and insulating material for producing high-frequency electronic component 中央硝子株式会社 2023-05-30 CN disclosed
CN-116075424-A Polybenzoxazole, polyamide solution, insulating material for high-frequency electronic parts, high-frequency device, insulating material for high-frequency electronic parts production, process for producing polyamide, process for producing polybenzoxazole, process for producing insulating material for high-frequency electronic parts, and diamine or salt thereof 中央硝子株式会社 2023-05-05 CN disclosed
CN-115803364-A Polyamide, polyamideimide and derivative thereof, optical film and display device, and method for producing them 中央硝子株式会社 2023-03-14 CN disclosed
US-11572442-B2 Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2023-02-07 US disclosed
EP-3896114-A1 NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317270-A1 NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed
US-10457780-B2 Hygromorphic polymers and copolymers having humidity-driven motility UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE (US) 2019-10-29 US disclosed
US-10087284-B2 Fluorine-containing polymerizable monomer and polymer compound using same CENTRAL GLASS COMPANY, LIMITED (JP) 2018-10-02 US disclosed
US-5126410-A Solvent resistant polybenzoxazoles, polybenzothiazoles and polybenzimidazoles THE BOEING COMPANY (US) 1992-06-30 US disclosed
US-5120819-A Heat and sovent-resistant polybenzoxazoles,-thiazoles and -imidazoles for aerospace applications BOEING COMPANY (US) 1992-06-09 US disclosed
US-5082905-A Blended heterocycles THE BOEING COMPANY (US) 1992-01-21 US disclosed
US-5066541-A Heterocycle oligomer blends THE BOEING COMPANY (US) 1991-11-19 US disclosed
US-4965336-A PHENYLIMIDE ACID HALIDE ENCAPPED POLYBENZOXAZLES; CURABLE, SOLVENT RESISTANCE PREPREGS THE BOEING COMPANY (US) 1990-10-23 US disclosed
US-4868270-A Heterocycle sulfone oligomers and blends THE BOEING COMPANY (US) 1989-09-19 US disclosed
US-4864009-A Molding composition consisting of aliphatic/aromatic copolyamide HUELS AKTIENGESELLSCHAFT (DE) 1989-09-05 US disclosed
US-4845286-A HEAT AND OXIDATION RESISTANT RESINS THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE (US) 1989-07-04 US disclosed
EP-0309649-A2 High performance heterocycle oligomers and blends THE BOEING COMPANY (US) 1989-04-05 EP disclosed
US-4547553-A CROSSLINKED SOLVENT RESISTANT THERMOPLASTIC RESIN THE BOEING COMPANY (US) 1985-10-15 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10457780-B2 Hygromorphic polymers and copolymers having humidity-driven motility DNAH12, PARG, PARN AKR1C3 4603/4885KDM4E 4172/4885ALDH1A1 2805/4885
US-11572442-B2 Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component BRIX1, RBX1, HAX1 AKR1C3 3444/4885KDM4E 1497/4885ALDH1A1 3045/4885
US-20210317270-A1 NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT BRIX1, HAX1, RBX1 AKR1C3 3251/4885KDM4E 1852/4885ALDH1A1 2917/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.