Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 3/20 | 0.35 |
| ▸ | MEN1 | O00255 | 1/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 7/20 | 0.34 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 4/20 | 0.33 |
| ▸ | ACHE | P22303 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 2/20 | 0.32 |
| ▸ | TP53 | P04637 | 3/20 | 0.32 |
| ▸ | NPC1 | O15118 | 2/20 | 0.32 |
| ▸ | RAB9A | P51151 | 2/20 | 0.32 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.32 |
| ▸ | HPGD | P15428 | 1/20 | 0.32 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.32 |
| ▸ | NFKB2 | Q00653 | 1/20 | 0.32 |
| ▸ | RELA | Q04206 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.32 |
| ▸ | TEAD4 | Q15561 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16749894 | 0.89 | HPGD (0.31) | HPGD | |
| SCHEMBL20679531 | 0.81 | — | — | |
| SCHEMBL15677724 | 0.80 | ACHE (0.36) | MEN1KMT2ATDP1ALDH1A1ACHE | |
| SCHEMBL7649982 | 0.78 | ESR1 (0.45) | MAPTMEN1KMT2AALDH1A1CYP3A4 | |
| SCHEMBL4795729 | 0.77 | ESR1 (0.37) | — | |
| SCHEMBL28390398 | 0.77 | CA1 (0.46) | MAPTMEN1KMT2ATDP1MAPK1 | |
| SCHEMBL127697 | 0.77 | MAPT (0.42) | MAPTMEN1KMT2ATDP1MAPK1 | |
| SCHEMBL3391059 | 0.76 | CYP3A4 (0.39) | MAPTMEN1KMT2ATDP1ALDH1A1 | |
| SCHEMBL1172627 | 0.75 | TDP1 (0.44) | MAPTMEN1KMT2ATDP1MAPK1 | |
| SCHEMBL124891 | 0.73 | MAPT (0.38) | MAPTMEN1KMT2ATDP1MAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-10087825-A | — | — | None | — | — | JP | disclosed |
| CN-115956301-A | Display device and method for manufacturing display device | 东丽株式会社 | 2023-04-11 | — | — | CN | disclosed |
| CN-115636847-A | Modified silane coupling agent, preparation method thereof and application of modified silane coupling agent in positive photosensitive resin composition | 明士(北京)新材料开发有限公司 | 2023-01-24 | — | — | CN | disclosed |
| CN-114957660-A | Polyimide resin composition, polyimide resin adhesive layer, laminate, and method for producing electronic component | 新应材股份有限公司 | 2022-08-30 | — | — | CN | disclosed |
| CN-114721223-A | Photosensitive resin, photosensitive resin composition, cured product, pattern forming method, and integrated circuit device | 华为技术有限公司 | 2022-07-08 | — | — | CN | disclosed |
| CN-107924125-B | Positive photosensitive resin composition, uncured and cured pattern formed therefrom, semiconductor device using the same, and method for manufacturing the same | 东丽株式会社 | 2020-12-25 | — | — | CN | disclosed |
| CN-108779331-B | Resin composition, cured relief pattern thereof, and method for producing semiconductor electronic component or semiconductor device using same | 东丽株式会社 | 2020-08-25 | — | — | CN | disclosed |
| US-20190033714-A1 | RESIN COMPOSITION, CURED RELIEF PATTERN THEREOF, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELECTRONIC COMPONENT OR SEMICONDUCTOR EQUIPMENT USING THE SAME | TORAY INDUSTRIES, INC. (JP) | 2019-01-31 | — | — | US | disclosed |
| US-7932412-B2 | Method of manufacturing an aminoaryl-containing organosilicon compound and method of manufacturing an intermediate product of the aforementioned compound | DOW CORNING TORAY CO., LTD. (JP) | 2011-04-26 | — | — | US | disclosed |
| EP-1797103-B1 | Preparation of an aminoaryl-containing organosilicon compound and intermediate used in its preparation | DOW CORNING TORAY CO LTD (JP) | 2010-12-29 | — | — | EP | disclosed |
| EP-1797103-A2 | PREPARATION OF AN AMINOARYL-CONTAINING ORGANOSILICON COMPOUND AND METHODS OF PREPARAING INTERMEDIATES USED IN ITS PREPARATION | Dow Corning Toray Co., Ltd. (JP) | 2007-06-20 | — | — | EP | disclosed |
| WO-2006038707-A2 | PREPARATION OF AN AMINOARYL-CONTAINING ORGANOSILICON COMPOUND AND METHODS OF PREPARAING INTERMEDIATES USED IN ITS PREPARATRION | DOW CORNING TORAY CO., LTD. (JP) | 2006-04-13 | — | — | WO | disclosed |
| JP-H1087825-A | LIQUID CRYSTAL ALIGNING AGENT | SUMITOMO BAKELITE CO LTD | 1998-04-07 | — | — | JP | disclosed |
| US-5633112-A | Photosensitive resin composition containing a carboxylic acid polymer, photoacid generator and secondary or tertiary aliphatic amine | HITACHI, LTD. (JP) | 1997-05-27 | — | — | US | disclosed |