SCHEMBL1642965

SCHEMBL1642965

C=CC(=O)OCOc1ccccc1

nearest known ligand 0.72

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.72
ALOX15 P16050 1/20 0.47
SMN1; SMN2 Q16637 3/20 0.44
MEN1 O00255 2/20 0.44
KMT2A Q03164 2/20 0.44
KDM4E B2RXH2 1/20 0.44
ALDH1A1 P00352 5/20 0.42
RAB9A P51151 2/20 0.42
GLA P06280 1/20 0.42
GAA P10253 1/20 0.42
HTT P42858 1/20 0.42
PKM P14618 1/20 0.42
TEAD1 P28347 1/20 0.41
TEAD3 Q99594 1/20 0.41
TSHR P16473 5/20 0.40
TGM2 P21980 1/20 0.40
NPC1 O15118 1/20 0.40
CYP2C9 P11712 1/20 0.40
CYP2C19 P33261 1/20 0.40
PARP10 Q53GL7 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14010348 0.90 THRB (0.59) THRBSMN1; SMN2ALDH1A1RAB9ANPC1
SCHEMBL14845417 0.87 THRB (0.56) THRBSMN1; SMN2MEN1KMT2AALDH1A1
SCHEMBL14010387 0.87 THRB (0.56) THRBSMN1; SMN2MEN1KMT2AALDH1A1
SCHEMBL16893716 0.86 THRB (0.79) THRBALOX15SMN1; SMN2MEN1KMT2A
SCHEMBL23581927 0.86 THRB (0.55) THRB
SCHEMBL26750219 0.86 THRB (0.55) THRBSMN1; SMN2MEN1KMT2AKDM4E
SCHEMBL11917942 0.85 THRB (0.53) THRBSMN1; SMN2ALDH1A1RAB9AHTT
SCHEMBL10013677 0.84 ALDH1A1 (0.55) THRBSMN1; SMN2ALDH1A1RAB9AHTT
SCHEMBL34035 0.84 THRB (1.00) THRBALOX15SMN1; SMN2MEN1KMT2A
SCHEMBL17933723 0.84 THRB (0.51) THRBALDH1A1TSHRCYP2C19TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 112 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112724915-B Reactive polyurethane hot melt adhesive with multiple curing modes and preparation method thereof 韦尔通(厦门)科技股份有限公司 2022-06-14 CN claimed
CN-112724915-A Reactive polyurethane hot melt adhesive with multiple curing modes and preparation method thereof 厦门韦尔通科技有限公司 2021-04-30 CN claimed
US-8993213-B2 Positive-working lithographic printing plate EASTMAN KODAK COMPANY (US) 2015-03-31 US claimed
US-20150072289-A9 POSITIVE-WORKING LITHOGRAPHIC PRINTING PLATE BANK OF AMERICA, N.A., AS AGENT 2015-03-12 US claimed
US-20140162187-A1 POSITIVE-WORKING LITHOGRAPHIC PRINTING PLATE SAVARIAR-HAUCK CELIN (DE) 2014-06-12 US claimed
CN-101087862-B Photochromic compounds comprising polymeric substituents, process for their preparation and their use POLYMERS AUSTRALIA PTY LTD 2011-10-26 CN claimed
CN-101087862-A Photochromic compounds comprising polymeric substituents, process for their preparation and their use POLYMERS AUSTRALIA PTY LTD (AU) 2007-12-12 CN claimed
JP-62148346-A None JP disclosed
CN-120010185-A Low-temperature-curable photosensitive resin composition and OLED display using same 深圳市容大感光科技股份有限公司 2025-05-16 CN disclosed
EP-4334287-A1 NLRP3 INFLAMMASOME-INHIBITING COMPOUNDS AND THE USE THEREOF Università Degli Studi Di Torino (IT) 2024-03-13 EP disclosed
WO-2022234447-A1 NLRP3 INFLAMMASOME-INHIBITING COMPOUNDS AND THE USE THEREOF UNIVERSITA' DEGLI STUDI DI TORINO (IT) 2022-11-10 WO disclosed
WO-2022176887-A1 EASILY DISMANTLABLE BONDING MATERIAL, BONDED BODY, AND DISMANTLING METHOD 国立大学法人九州大学 2022-08-25 WO disclosed
CN-111642848-B Bionic flower capable of releasing fragrance and attracting insects at night or in dark condition and preparation method thereof 温州科技职业学院 2022-07-22 CN disclosed
US-6927242-B2 Resin composition, coating materials containing the same, coating film and process for forming the film MITSUI CHEMICALS, INC. (JP) 2005-08-09 US disclosed
CN-1533421-A Radiation curable adhesive composition having natural rubber based particles dispersed therein ����ͨѶ�ɷ����޹�˾ 2004-09-29 CN disclosed
EP-1362891-A1 RESIN COMPOSITION, COATING MATERIALS CONTAINING THE SAME, COATING FILM AND PROCESS FOR FORMING THE FILM Mitsui Chemicals, Inc. (JP) 2003-11-19 EP disclosed
US-20030139515-A1 Resin composition, coating materials containing the same, coating film and process for forming the film MITSUI CHEMICALS INC. (JP) 2003-07-24 US disclosed
EP-0814374-A2 Stabilized heat-sensitive imaging material LABELON CORPORATION (US) 1997-12-29 EP disclosed
US-5672560-A PHOSPHATE LABELON CORPORATION (US) 1997-09-30 US disclosed
JP-S62148346-A MATERIAL FOR COATING OPTICAL GLASS FIBER NIPPON SODA CO LTD 1987-07-02 JP disclosed