Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 10/20 | 0.48 |
| ▸ | FAAH | O00519 | 3/20 | 0.48 |
| ▸ | NR1H2 | P55055 | 1/20 | 0.38 |
| ▸ | NR1H3 | Q13133 | 1/20 | 0.38 |
| ▸ | TLR9 | Q9NR96 | 2/20 | 0.36 |
| ▸ | G6PD | P11413 | 1/20 | 0.36 |
| ▸ | DAO | P14920 | 1/20 | 0.35 |
| ▸ | PTGS1 | P23219 | 3/20 | 0.34 |
| ▸ | PTGS2 | P35354 | 3/20 | 0.34 |
| ▸ | CTRC | Q99895 | 1/20 | 0.33 |
| ▸ | PLK1 | P53350 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | HPGD | P15428 | 1/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8678980 | 0.92 | MGLL (0.53) | MGLLFAAHNR1H2NR1H3TLR9 | |
| SCHEMBL19511516 | 0.91 | MGLL (0.51) | MGLLFAAHTLR9G6PDALDH1A1 | |
| SCHEMBL30104189 | 0.85 | MGLL (0.59) | MGLLFAAHTLR9G6PDALDH1A1 | |
| SCHEMBL29929064 | 0.85 | MGLL (0.59) | MGLLFAAHTLR9G6PDALDH1A1 | |
| SCHEMBL332215 | 0.85 | MGLL (0.59) | MGLLFAAHTLR9G6PDALDH1A1 | |
| SCHEMBL28170465 | 0.83 | MGLL (0.49) | MGLLFAAHNR1H2NR1H3TLR9 | |
| SCHEMBL9838844 | 0.82 | TYR (0.50) | MGLLFAAHNR1H2NR1H3TLR9 | |
| SCHEMBL8854721 | 0.80 | MGLL (0.44) | MGLLFAAHNR1H2NR1H3DAO | |
| SCHEMBL8727167 | 0.78 | MGLL (0.42) | MGLLFAAHNR1H2NR1H3TLR9 | |
| SCHEMBL3873448 | 0.78 | MGLL (0.73) | MGLLFAAHNR1H2NR1H3TLR9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20220112373-A1 | THERMOSETTING RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2022-04-14 | — | — | US | disclosed |
| CN-109689742-B | Curable resin mixture and method for producing curable resin composition | 昭和电工株式会社 | 2021-12-10 | — | — | CN | disclosed |
| US-20210284783-A1 | METHODS FOR PRODUCING CURABLE RESIN MIXTURE AND CURABLE RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2021-09-16 | — | — | US | disclosed |
| CN-113316597-A | Thermosetting resin composition | 昭和电工株式会社 | 2021-08-27 | — | — | CN | disclosed |
| US-10689493-B2 | Thermosetting resin composition | SHOWA DENKO K.K. (JP) | 2020-06-23 | — | — | US | disclosed |
| WO-2020070531-A1 | CURABLE RESIN COMPOSITION, CURED OBJECT THEREFROM, METHOD FOR PRODUCING STRUCTURE USING SAID CURABLE RESIN COMPOSITION, AND STRUCTURE INCLUDING SAID CURED OBJECT | 昭和電工株式会社 | 2020-04-09 | — | — | WO | disclosed |
| EP-3613780-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF | Showa Denko K.K. (JP) | 2020-02-26 | — | — | EP | disclosed |
| EP-3613781-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF | Showa Denko K.K. (JP) | 2020-02-26 | — | — | EP | disclosed |
| US-20200031966-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF | SHOWA DENKO K.K. (JP) | 2020-01-30 | — | — | US | disclosed |
| US-20200031973-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF | SHOWA DENKO K.K. (JP) | 2020-01-30 | — | — | US | disclosed |
| US-20180282494-A1 | THERMOSETTING RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2018-10-04 | — | — | US | disclosed |
| US-20170349743-A1 | THERMOSETTING RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2017-12-07 | — | — | US | disclosed |
| EP-3239200-A1 | THERMOSETTING RESIN COMPOSITION | Showa Denko K.K. (JP) | 2017-11-01 | — | — | EP | disclosed |
| EP-3239199-A1 | THERMOSETTING RESIN COMPOSITION | Showa Denko K.K. (JP) | 2017-11-01 | — | — | EP | disclosed |
| US-8227361-B2 | Prepreg and printed wiring board using thin quartz glass cloth | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-07-24 | — | — | US | disclosed |
| US-20110088933-A1 | LOW DIELECTRIC LOSS WIRING BOARD, MULTILAYER WIRING BOARD, COPPER FOIL AND LAMINATE | HITACHI, LTD. (JP) | 2011-04-21 | — | — | US | disclosed |
| US-7638564-B2 | Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish | HITACHI CHEMICAL CO., LTD. (JP) | 2009-12-29 | — | — | US | disclosed |
| US-20090266591-A1 | Prepreg and printed wiring board using thin quartz glass cloth | RESONAC CORPORATION (JP) | 2009-10-29 | — | — | US | disclosed |
| US-20080261472-A1 | PREPREG, MULTILAYER PRINTED WIRING BOARD AND ELECTRONIC PARTS USING THE SAME | HITACHI CHEMICAL CO., LTD. | 2008-10-23 | — | — | US | disclosed |
| US-20070077413-A1 | Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish | HITACHI CHEMICAL CO., LTD. (JP) | 2007-04-05 | — | — | US | disclosed |