Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 15/20 | 0.59 |
| ▸ | FAAH | O00519 | 4/20 | 0.48 |
| ▸ | TLR9 | Q9NR96 | 3/20 | 0.41 |
| ▸ | G6PD | P11413 | 1/20 | 0.40 |
| ▸ | TSHR | P16473 | 2/20 | 0.38 |
| ▸ | LMNA | P02545 | 1/20 | 0.38 |
| ▸ | HPGD | P15428 | 1/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.38 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.38 |
| ▸ | MITF | O75030 | 1/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.35 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.35 |
| ▸ | HTT | P42858 | 1/20 | 0.35 |
| ▸ | ATM | Q13315 | 1/20 | 0.35 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29929064 | 1.00 | MGLL (0.59) | MGLLFAAHTLR9G6PDTSHR | |
| SCHEMBL30104189 | 1.00 | MGLL (0.59) | MGLLFAAHTLR9G6PDTSHR | |
| SCHEMBL8678791 | 0.91 | MGLL (0.61) | MGLLFAAHTLR9G6PDTSHR | |
| SCHEMBL19511516 | 0.88 | MGLL (0.51) | MGLLFAAHTLR9G6PDMITF | |
| SCHEMBL27054308 | 0.87 | MGLL (0.46) | MGLLFAAHTLR9G6PDTSHR | |
| SCHEMBL1645765 | 0.85 | MGLL (0.48) | MGLLFAAHTLR9G6PDHPGD | |
| SCHEMBL14892274 | 0.83 | MGLL (0.49) | MGLLFAAHTLR9G6PDTSHR | |
| SCHEMBL9615439 | 0.81 | MGLL (0.68) | MGLLFAAHTLR9G6PDHSP90AA1 | |
| SCHEMBL1258019 | 0.81 | MGLL (0.55) | MGLLFAAHTLR9G6PDMITF | |
| SCHEMBL30279692 | 0.81 | MGLL (0.55) | MGLLFAAHTLR9G6PDMITF |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 125 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119490747-A | Resin composition, prepreg comprising same, laminated board and metal foil-clad laminated board | 广东生益科技股份有限公司 | 2025-02-21 | — | — | CN | claimed |
| CN-118256088-A | Resin composition and application thereof | 广东生益科技股份有限公司 | 2024-06-28 | — | — | CN | claimed |
| CN-118240341-A | Thermosetting resin composition and application thereof | 广东生益科技股份有限公司 | 2024-06-25 | — | — | CN | claimed |
| CN-118240342-A | Thermosetting resin composition and application thereof | 广东生益科技股份有限公司 | 2024-06-25 | — | — | CN | claimed |
| CN-116496199-A | Modified maleimide compound and application thereof | 广东生益科技股份有限公司 | 2023-07-28 | — | — | CN | claimed |
| CN-116410595-A | Resin composition, prepreg comprising same, and metal foil-clad laminate | 广东生益科技股份有限公司 | 2023-07-11 | — | — | CN | claimed |
| CN-116410596-A | Resin composition and application thereof | 广东生益科技股份有限公司 | 2023-07-11 | — | — | CN | claimed |
| CN-116410594-A | Resin composition, prepreg and metal foil-clad laminate | 广东生益科技股份有限公司 | 2023-07-11 | — | — | CN | claimed |
| CN-119490747-A | Resin composition, prepreg comprising same, laminated board and metal foil-clad laminated board | 广东生益科技股份有限公司 | 2025-02-21 | — | — | CN | disclosed |
| CN-116410595-B | Resin composition, prepreg comprising same, and metal foil-clad laminate | 广东生益科技股份有限公司 | 2025-02-14 | — | — | CN | disclosed |
| CN-116410596-B | Resin composition and application thereof | 广东生益科技股份有限公司 | 2025-02-14 | — | — | CN | disclosed |
| WO-2024185371-A1 | RESIN COMPOSITION, AND INTER-LAYER INSULATING ADHESIVE FILM, LAMINATED CIRCUIT BOARD, ELECTRONIC COMPONENT, AND SEMICONDUCTOR DEVICE USING SAME | ナミックス株式会社 | 2024-09-12 | — | — | WO | disclosed |
| CN-118256088-A | Resin composition and application thereof | 广东生益科技股份有限公司 | 2024-06-28 | — | — | CN | disclosed |
| EP-3405010-B1 | MULTILAYER TRANSMISSION LINE PLATE | RESONAC CORP (JP) | 2024-06-26 | — | — | EP | disclosed |
| US-20070155047-A1 | Wafer-level processing of chip-packaging compositions including bis-maleimides | INTEL CORPORATION | 2007-07-05 | — | — | US | disclosed |
| US-20070077413-A1 | Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish | HITACHI CHEMICAL CO., LTD. (JP) | 2007-04-05 | — | — | US | disclosed |
| EP-1698647-A1 | POLYMER AND PROCESS FOR PRODUCING POLYMER | KANSAI PAINT CO., LTD. (JP) | 2006-09-06 | — | — | EP | disclosed |
| US-7081486-B2 | Method of producing polymer | SHIZUOKA UNIVERSITY (JP) | 2006-07-25 | — | — | US | disclosed |
| EP-1598374-A1 | METHOD OF PRODUCING POLYMER | Japan as represented by President of Shizuoka University (JP) | 2005-11-23 | — | — | EP | disclosed |
| US-20050143481-A1 | Method of producing polymer | KANSAI PAINT CO., LTD. (JP) | 2005-06-30 | — | — | US | disclosed |