SCHEMBL1646705

SCHEMBL1646705

C=Cc1ccc(C(C)c2ccc(C(C)c3cccc(C=C)c3)cc2)cc1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.47
TDP1 Q9NUW8 1/20 0.47
PTGS2 P35354 2/20 0.45
ALDH1A1 P00352 3/20 0.41
TSHR P16473 1/20 0.41
ESR1 P03372 1/20 0.34
PDCD1 Q15116 1/20 0.34
ESR2 Q92731 1/20 0.34
CD274 Q9NZQ7 1/20 0.34
TBXAS1 P24557 2/20 0.33
TRPA1 O75762 1/20 0.33
HDAC8 Q9BY41 2/20 0.32
EGFR P00533 1/20 0.32
TYR P14679 1/20 0.31
DAO P14920 1/20 0.31
MAPT P10636 1/20 0.30
PKM P14618 1/20 0.30
ADRB1 P08588 1/20 0.30
MIF P14174 1/20 0.30
HTR2A P28223 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1648716 0.98 TP53 (0.46) TP53TDP1PTGS2ALDH1A1TSHR
SCHEMBL1646924 0.96 TP53 (0.50) TP53TDP1PTGS2ALDH1A1TSHR
SCHEMBL1646805 0.92 ALDH1A1 (0.44) TP53TDP1PTGS2ALDH1A1TSHR
SCHEMBL593657 0.92 TP53 (0.54) TP53TDP1PTGS2ALDH1A1TSHR
SCHEMBL7932288 0.91 TDP1 (0.48) TP53TDP1PTGS2ALDH1A1TSHR
SCHEMBL1645654 0.90 TP53 (0.52) TP53TDP1PTGS2ALDH1A1TSHR
SCHEMBL5662398 0.90 TP53 (0.42) TP53TDP1PTGS2ALDH1A1TSHR
Styrene SCHEMBL1194127 0.84 ALDH1A1 (0.61) TP53TDP1PTGS2ALDH1A1TSHR
SCHEMBL9806285 0.84 ALDH1A1 (0.54) PTGS2ALDH1A1TSHRESR1PDCD1
SCHEMBL1647492 0.84 ALDH1A1 (0.58) TP53TDP1PTGS2ALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115975348-A Resin composition, prepreg, circuit board and printed circuit board 珠海华正新材料有限公司 2023-04-18 CN claimed
US-20260146124-A1 RESIN COMPOSITION AND USES OF THE SAME TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2026-05-28 US disclosed
US-20250129242-A1 RESIN COMPOSITION AND USES OF THE SAME TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2025-04-24 US disclosed
CN-111690247-B Resin composition and use thereof 台燿科技股份有限公司 2024-01-02 CN disclosed
CN-113667232-B Resin composition, prepreg, metal foil laminate and printed wiring board each produced using the same 台燿科技股份有限公司 2023-09-01 CN disclosed
US-11667743-B2 Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the same TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2023-06-06 US disclosed
CN-115975348-A Resin composition, prepreg, circuit board and printed circuit board 珠海华正新材料有限公司 2023-04-18 CN disclosed
US-11345813-B2 Resin composition, pre-preg, metal-clad laminate, and printed circuit board using the same TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2022-05-31 US disclosed
CN-110862668-B Halogen-free low dielectric resin composition, and prepreg, metal foil laminate and printed wiring board manufactured using the same 台燿科技股份有限公司 2022-05-06 CN disclosed
CN-113667232-A Resin composition, prepreg, metal foil laminate and printed wiring board produced using the same 台燿科技股份有限公司 2021-11-19 CN disclosed
CN-110551257-A Resin composition, prepreg thereof, metal foil laminate and printed wiring board TAIWAN UNION TECHNOLOGY CORP 2019-12-10 CN disclosed
US-8420210-B2 Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-04-16 US disclosed
US-20110088933-A1 LOW DIELECTRIC LOSS WIRING BOARD, MULTILAYER WIRING BOARD, COPPER FOIL AND LAMINATE HITACHI, LTD. (JP) 2011-04-21 US disclosed
EP-1966290-A2 POROUS MONOLITHIC ORGANIC COPOLYMER FOR BIOPOLYMER CHROMATOGRAPHY Leopold-Franzens-Universität Innsbruck (AT) 2008-09-10 EP disclosed
US-20070292668-A1 RESIN COMPOSITION, PREPREG, LAMINATE SHEET AND PRINTED WIRING BOARD USING THE SAME AND METHOD FOR PRODUCTION THEREOF AMOU SATORU 2007-12-20 US disclosed
US-7273900-B2 Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof HITACHI CHEMICAL COMPANY, LTD. (JP) 2007-09-25 US disclosed
WO-2007073865-A2 POROUS MONOLITHIC ORGANIC COPOLYMER FOR BIOPOLYMER CHROMATOGRAPHY LEOPOLD-FRANZENS-UNIVERSITÄT INNSBRUCK (AT) 2007-07-05 WO disclosed
US-20070144972-A1 Monolithic Organic Copolymer for Biopolymer Chromatography LEOPOLD-FRANZENS-UNIVERSITAT INNSBRUCK (AT) 2007-06-28 US disclosed
US-20050064159-A1 Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof HITACHI CHEMICAL COMPANY, LTD. (JP) 2005-03-24 US disclosed
EP-1517595-A2 Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof HITACHI CHEMICAL CO., LTD. (JP) 2005-03-23 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260146124-A1 RESIN COMPOSITION AND USES OF THE SAME ARCN1, ASH2L, ITGA1 TP53 3510/4885TDP1 2805/4885PTGS2 1274/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.