⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1979284 | 0.83 | AOC1 (0.61) | — | |
| SCHEMBL1930789 | 0.82 | — | — | |
| SCHEMBL29964442 | 0.82 | — | — | |
| SCHEMBL30210557 | 0.79 | — | — | |
| SCHEMBL12833330 | 0.79 | — | — | |
| SCHEMBL3819598 | 0.79 | — | — | |
| SCHEMBL5748797 | 0.79 | — | — | |
| SCHEMBL29900474 | 0.78 | AOC1 (0.43) | — | |
| SCHEMBL6249306 | 0.78 | AOC1 (0.43) | — | |
| Hydrochloric Acid SCHEMBL3814561 | 0.77 | AOC1 (1.00) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 144 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119751906-A | Bio-based hyperbranched epoxy resin/bisphenol A epoxy resin composite resin containing imide structure | 中南民族大学 | 2025-04-04 | — | — | CN | claimed |
| WO-2009023669-A1 | SUBSTITUTED 5,6,7,8-TETRAHYDROQUINOLINE DERIVATIVES, COMPOSITIONS, AND METHODS OF USE THEREOF | JANSSEN PHARMACEUTICA N.V. (BE) | 2009-02-19 | — | — | WO | claimed |
| US-20090048295-A1 | SUBSTITUTED 5,6,7,8-TETRAHYDROQUINOLINE DERIVATIVES, COMPOSITIONS, AND METHODS OF USE THEREOF | JANSSEN PHARMACEUTICE N.V. (BE) | 2009-02-19 | — | — | US | claimed |
| US-20250205348-A1 | NOVEL PEPTIDIC LINKERS AND CRYPTOPHYCIN CONJUGATES, THEIR PREPARATION AND THEIR THERAPEUTIC USE | SANOFI (FR) | 2025-06-26 | — | — | US | disclosed |
| CN-119751906-A | Bio-based hyperbranched epoxy resin/bisphenol A epoxy resin composite resin containing imide structure | 中南民族大学 | 2025-04-04 | — | — | CN | disclosed |
| US-20250109148-A1 | HETEROCYCLIC GLP-1 AGONISTS | SHANGHAI SHOUTI BIOTECHNOLOGY CO., LTD. (CN) | 2025-04-03 | — | — | US | disclosed |
| CN-119343339-A | Heterocyclic GLP-1 agonists | 加舒布鲁姆生物公司 | 2025-01-21 | — | — | CN | disclosed |
| EP-4469444-A1 | HETEROCYCLIC GLP-1 AGONISTS | Gasherbrum Bio, Inc. (US) | 2024-12-04 | — | — | EP | disclosed |
| WO-2024199069-A1 | POLYARYL-CONTAINING MACROCYCLIC COMPOUND AND USE THEREOF | 浙江养生堂天然药物研究所有限公司 | 2024-10-03 | — | — | WO | disclosed |
| CN-118724916-A | Polyaryl-containing macrocyclic compounds and uses thereof | 浙江养生堂天然药物研究所有限公司 | 2024-10-01 | — | — | CN | disclosed |
| US-11998611-B2 | Cryptophycin antibody conjugates for the treatment of cancer | SANOFI (FR) | 2024-06-04 | — | — | US | disclosed |
| EP-1539742-A1 | INDOLE DERIVATIVES USEFUL AS HISTAMINE H3 ANTAGONISTS | SCHERING CORPORATION (US) | 2005-06-15 | — | — | EP | disclosed |
| US-20040097513-A1 | Novel non-imidazole compounds | ASLANIAN ROBERT G (US) | 2004-05-20 | — | — | US | disclosed |
| US-6720328-B2 | TREATING ALLERGY, ALLERGY-INDUCED AIRWAY RESPONSES, AND CONGESTION (E.G., NASAL CONGESTION) | SCHERING CORPORATION | 2004-04-13 | — | — | US | disclosed |
| US-20040019099-A1 | Treating inflammatory diseases, allergic conditions and central nervous system disorders | SCHERING CORPORATION | 2004-01-29 | — | — | US | disclosed |
| WO-2004000831-A1 | INDOLE DERIVATIVES USEFUL AS HISTAMINE H3 ANTAGONISTS | SCHERING CORPORATION (US) | 2003-12-31 | — | — | WO | disclosed |
| EP-1326858-A2 | PIPERIDINE COMPOUNDS AS ANTI-ALLERGIC | Schering Corporation (US) | 2003-07-16 | — | — | EP | disclosed |
| US-20030109682-A1 | Maytansines and maytansine conjugates | SANTI DANIEL (US) | 2003-06-12 | — | — | US | disclosed |
| US-20030045519-A1 | Novel non-imidazole compounds | SCHERING CORPORATION | 2003-03-06 | — | — | US | disclosed |
| WO-2002032893-A2 | PIPERIDINE COMPOUNDS AS ANTI-ALLERGIC | SCHERING CORPORATION (US) | 2002-04-25 | — | — | WO | disclosed |