SCHEMBL16590874

SCHEMBL16590874

C=Cc1ccc(OCC(F)(F)C(F)(F)C(F)(F)COc2c(F)c(F)c(S(=O)(=O)O)c(F)c2F)cc1

nearest known ligand 0.36

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
▸ TDP1 Q9NUW8 1/20 0.36
▸ USP2 O75604 1/20 0.33
▸ MAPT P10636 1/20 0.33
▸ TSHR P16473 1/20 0.33
▸ CHRNB2 P17787 1/20 0.31
▸ CHRNB4 P30926 1/20 0.31
▸ CHRNA3 P32297 1/20 0.31
▸ CHRNA7 P36544 1/20 0.31
▸ CHRNA4 P43681 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16590906 0.84 — —
SCHEMBL14838098 0.82 TDP1 (0.41) TDP1MAPTCHRNB2CHRNB4CHRNA3
SCHEMBL16596689 0.81 USP2 (0.32) USP2MAPTTSHRCHRNB2CHRNB4
SCHEMBL16590884 0.77 TDP1 (0.39) TDP1
SCHEMBL15189382 0.77 TDP1 (0.46) TDP1MAPTTSHR
SCHEMBL2742186 0.76 TDP1 (0.42) TDP1MAPTTSHR
SCHEMBL2742174 0.76 TDP1 (0.38) TDP1TSHR
SCHEMBL2742171 0.75 TDP1 (0.37) TDP1CHRNB2CHRNB4CHRNA3CHRNA7
SCHEMBL16683010 0.75 TDP1 (0.44) TDP1MAPTTSHR
SCHEMBL16590881 0.74 CHRNB2 (0.40) TDP1MAPTCHRNB2CHRNB4CHRNA3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20150086912-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM AND PATTERN FORMING METHOD USING THE SAME, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2015-03-26 — — US disclosed
US-20150086912-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM AND PATTERN FORMING METHOD USING THE SAME, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2015-03-26 — — US disclosed
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