SCHEMBL16613151

SCHEMBL16613151

CO[Si](OC)(OC)c1cccs1

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RPS6KB2 Q9UBS0 2/20 0.35
SMN1; SMN2 Q16637 3/20 0.33
ALDH1A1 P00352 3/20 0.33
KDM4E B2RXH2 3/20 0.33
HPGD P15428 2/20 0.33
HSD17B10 Q99714 2/20 0.33
GAA P10253 1/20 0.33
MEN1 O00255 2/20 0.32
MAPT P10636 2/20 0.32
KMT2A Q03164 2/20 0.32
L3MBTL1 Q9Y468 2/20 0.32
TDP1 Q9NUW8 1/20 0.32
FBP1 P09467 1/20 0.32
ADORA2A P29274 1/20 0.32
ADORA1 P30542 1/20 0.32
CYP1A1 P04798 2/20 0.32
CYP1A2 P05177 2/20 0.32
CYP1B1 Q16678 2/20 0.32
DPP4 P27487 1/20 0.32
NPC1 O15118 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28351417 0.84 DPP4 (0.32) RPS6KB2SMN1; SMN2ALDH1A1KDM4EHPGD
SCHEMBL8914799 0.81 RPS6KB2 (0.35) RPS6KB2ALDH1A1KDM4EHPGDHSD17B10
SCHEMBL14958040 0.81 RPS6KB2 (0.35) RPS6KB2ALDH1A1KDM4EHPGDHSD17B10
SCHEMBL27473536 0.79 RPS6KB2 (0.34) RPS6KB2SMN1; SMN2ALDH1A1KDM4EHPGD
SCHEMBL1984960 0.76 DPP4 (0.34) SMN1; SMN2ALDH1A1KDM4EHPGDHSD17B10
SCHEMBL19875003 0.74 RPS6KB2 (0.32) RPS6KB2SMN1; SMN2ALDH1A1HPGDNPC1
SCHEMBL19875057 0.74 RPS6KB2 (0.32) RPS6KB2SMN1; SMN2ALDH1A1HPGDNPC1
SCHEMBL19874953 0.73 CYP1A2 (0.31) RPS6KB2MEN1KMT2ACYP1A2
SCHEMBL2290788 0.72 FBP1 (0.36) SMN1; SMN2ALDH1A1KDM4EHPGDHSD17B10
SCHEMBL20550992 0.72 FBP1 (0.36) SMN1; SMN2ALDH1A1KDM4EHPGDHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119774585-A Preparation method of surface-modified hard carbon anode material of lithium ion battery 福建省鑫森炭业股份有限公司 2025-04-08 CN claimed
CN-119121436-A Radiation-proof fabric and preparation method thereof 江苏瑞爱福纺织科技有限公司 2024-12-13 CN claimed
CN-118579758-A Preparation method and application of element doped double-layer porous carbon based on in-situ polymerization 浙江格源新材料科技有限公司 2024-09-03 CN claimed
US-20230377959-A1 IN-SITU CMP SELF-ASSEMBLED MONOLAYER FOR ENHANCING METAL-DIELECTRIC ADHESION AND PREVENTING METAL DIFFUSION TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2023-11-23 US claimed
CN-116234336-A Perovskite solar cell and preparation method thereof 浙江工业大学 2023-06-06 CN claimed
CN-102093581-A Synthetic method of thienyl phenyl silicone resin for LED packaging DONGGUAN BETELY NEW MATERIALS CO LTD 2011-06-15 CN claimed
CN-120988197-A Preparation method of weather-resistant and anti-fouling organic-inorganic hybrid emulsion 广东衡光新材料科技有限公司 2025-11-21 CN disclosed
CN-120483544-B Corrosion-resistant glass and preparation method thereof 四川硅蓝新材料科技有限公司 2025-10-24 CN disclosed
CN-120483544-A Corrosion-resistant glass and preparation method thereof 四川硅蓝新材料科技有限公司 2025-08-15 CN disclosed
CN-119843496-A Radiation-proof fabric and preparation method thereof 浙江芝兰纺织科技有限公司 2025-04-18 CN disclosed
CN-119121436-A Radiation-proof fabric and preparation method thereof 江苏瑞爱福纺织科技有限公司 2024-12-13 CN disclosed
CN-119121436-A Radiation-proof fabric and preparation method thereof 江苏瑞爱福纺织科技有限公司 2024-12-13 CN disclosed
CN-118579758-A Preparation method and application of element doped double-layer porous carbon based on in-situ polymerization 浙江格源新材料科技有限公司 2024-09-03 CN disclosed
CN-105190901-A Field effect transistor TORAY INDUSTRIES 2015-12-23 CN disclosed
US-20150126700-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, ENCAPSULATING AGENT, AND OPTICAL SEMICONDUCTOR DEVICE DAICEL CORPORATION (JP) 2015-05-07 US disclosed
EP-2857457-A1 CURABLE RESIN COMPOSITION, AND CURED PRODUCT, SEALING AGENT, AND OPTICAL SEMICONDUCTOR DEVICE USING SAME Daicel Corporation (JP) 2015-04-08 EP disclosed
CN-104321385-A Curable resin composition, and cured product, sealing agent, and optical semiconductor device using same DAICEL CORP 2015-01-28 CN disclosed
CN-102093581-A Synthetic method of thienyl phenyl silicone resin for LED packaging DONGGUAN BETELY NEW MATERIALS CO LTD 2011-06-15 CN disclosed
CN-102093581-A Synthetic method of thienyl phenyl silicone resin for LED packaging DONGGUAN BETELY NEW MATERIALS CO LTD 2011-06-15 CN disclosed
CN-1174205-A Carrier catalyst system, its prep, and use in polymerization of olefines thereof HOECHST AG (DE) 1998-02-25 CN disclosed