⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8844858 | 0.82 | — | — | |
| SCHEMBL41912 | 0.82 | — | — | |
| SCHEMBL35987 | 0.82 | — | — | |
| SCHEMBL16874147 | 0.67 | — | — | |
| SCHEMBL259182 | 0.67 | — | — | |
| SCHEMBL7699567 | 0.67 | — | — | |
| SCHEMBL5827440 | 0.67 | — | — | |
| Lithium Ion SCHEMBL6890378 | 0.67 | — | — | |
| SCHEMBL1238193 | 0.67 | — | — | |
| SCHEMBL16632080 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 75 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111863857-B | LED display substrate and preparation method thereof and display panel | 京东方科技集团股份有限公司 | 2024-01-23 | — | — | CN | claimed |
| US-20230278868-A1 | A CORAL-LIKE COMPOSITE MATERIAL AND A METHOD OF PREPARING THE SAME | AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH (SG) | 2023-09-07 | — | — | US | claimed |
| US-20220393087-A1 | LED DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, DISPLAY PANEL | Beijing Boe Technology Development Co., Ltd. (CN) | 2022-12-08 | — | — | US | claimed |
| WO-2022001462-A1 | LED DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY PANEL | 京东方科技集团股份有限公司 | 2022-01-06 | — | — | WO | claimed |
| CN-111863857-A | LED display substrate and preparation method thereof | 京东方科技集团股份有限公司 | 2020-10-30 | — | — | CN | claimed |
| US-9466660-B2 | Semiconductor structures including molybdenum nitride, molybdenum oxynitride or molybdenum-based alloy material, and method of making such structures | MICRON TECHNOLOGY, INC. (US) | 2016-10-11 | — | — | US | claimed |
| WO-2015057508-A1 | SEMICONDUCTOR STRUCTURES INCLUDING MOLYBDENUM NITRIDE, MOLYBDENUM OXYNITRIDE OR MOLYBDENUM-BASED ALLOY MATERIAL, AND METHOD OF MAKING SUCH STRUCTURES | MICRON TECHNOLOGY, INC. (US) | 2015-04-23 | — | — | WO | claimed |
| US-20150102460-A1 | SEMICONDUCTOR STRUCTURES INCLUDING MOLYBDENUM NITRIDE, MOLYBDENUM OXYNITRIDE OR MOLYBDENUM-BASED ALLOY MATERIAL, AND METHOD OF MAKING SUCH STRUCTURES | MICRON TECHNOLOGY, INC. (US) | 2015-04-16 | — | — | US | claimed |
| CN-118139832-A | Cubic boron nitride sintered body | 住友电气工业株式会社 | 2024-06-04 | — | — | CN | disclosed |
| US-20240174576-A1 | CUBIC BORON NITRIDE SINTERED MATERIAL | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 2024-05-30 | — | — | US | disclosed |
| EP-4079705-B1 | CUBIC BORON NITRIDE SINTERED MATERIAL | SUMITOMO ELECTRIC INDUSTRIES (JP) | 2024-05-01 | — | — | EP | disclosed |
| EP-4079703-B1 | CUBIC BORON NITRIDE SINTERED MATERIAL | SUMITOMO ELECTRIC INDUSTRIES (JP) | 2024-05-01 | — | — | EP | disclosed |
| CN-117957208-A | Cubic boron nitride sintered body | 住友电工硬质合金株式会社 | 2024-04-30 | — | — | CN | disclosed |
| US-11958782-B2 | Cubic boron nitride sintered material | SUMITOMO ELECTRIC HARDMETAL CORP. (JP) | 2024-04-16 | — | — | US | disclosed |
| US-20190296065-A1 | ACTIVE MATRIX SUBSTRATE AND X-RAY IMAGING PANEL INCLUDING SAME | SHARP KABUSHIKI KAISHA (JP) | 2019-09-26 | — | — | US | disclosed |
| US-20180297899-A1 | SINTERED MATERIAL, TOOL INCLUDING SINTERED MATERIAL, AND SINTERED MATERIAL PRODUCTION METHOD | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 2018-10-18 | — | — | US | disclosed |
| CN-207909096-U | Electrode structure, Trackpad and touch device | 深圳莱宝高科技股份有限公司 | 2018-09-25 | — | — | CN | disclosed |
| US-10029948-B2 | Sintered material, tool including sintered material, and sintered material production method | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 2018-07-24 | — | — | US | disclosed |
| US-20170253531-A1 | SINTERED MATERIAL, TOOL INCLUDING SINTERED MATERIAL, AND SINTERED MATERIAL PRODUCTION METHOD | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 2017-09-07 | — | — | US | disclosed |
| EP-3187476-A1 | SINTERED BODY, TOOL USING SINTERED BODY, AND SINTERED BODY PRODUCTION METHOD | Sumitomo Electric Industries, Ltd. (JP) | 2017-07-05 | — | — | EP | disclosed |