SCHEMBL16641024

SCHEMBL16641024

CCO[Si](CCCN(CC1CO1)c1ccc(C(C)(C)c2ccc(C(C)(C)c3ccc(N(CCC[Si](OCC)(OCC)OCC)CC4CO4)cc3)cc2)cc1)(OCC)OCC

nearest known ligand 0.39

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TP53 P04637 2/20 0.39
MAPT P10636 2/20 0.39
HPGD P15428 2/20 0.39
TSHR P16473 2/20 0.39
MEN1 O00255 2/20 0.39
KMT2A Q03164 2/20 0.39
CYP1A2 P05177 1/20 0.39
ALDH1A1 P00352 1/20 0.39
PPARG P37231 1/20 0.39
HIF1A Q16665 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16641022 1.00 TP53 (0.39) TP53MAPTHPGDTSHRMEN1
SCHEMBL19901217 0.99 TP53 (0.39) TP53MAPTHPGDTSHRMEN1
SCHEMBL16641023 0.98 TP53 (0.39) TP53MAPTHPGDTSHRMEN1
SCHEMBL16640945 0.97 TP53 (0.37) TP53MAPTHPGDTSHRMEN1
SCHEMBL16640939 0.97 TP53 (0.37) TP53MAPTHPGDTSHRMEN1
SCHEMBL16640952 0.94 TP53 (0.37) TP53MAPTHPGDTSHRMEN1
SCHEMBL23521495 0.85 LMNA (0.37) TP53MAPTHPGDTSHRMEN1
SCHEMBL19901209 0.85
SCHEMBL16641020 0.84 MEN1 (0.42) TP53MAPTHPGDTSHRMEN1
SCHEMBL16640994 0.84 ALDH1A1 (0.34) TP53MAPTHPGDTSHRMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9902803-B2 Epoxy compound having alkoxy silyl group, composition comprising same, cured product, use thereof and method for preparing epoxy compound having alkoxy silyl group KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2018-02-27 US disclosed
US-20150105493-A1 EPOXY COMPOUND HAVING ALKOXY SILYL GROUP, COMPOSITION COMPRISING SAME, CURED PRODUCT, USE THEREOF AND METHOD FOR PREPARING EPOXY COMPOUND HAVING ALKOXY SILYL GROUP KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2015-04-16 US disclosed