SCHEMBL16672004

SCHEMBL16672004

CC(C)(c1ccc(O)cc1)c1ccc(OP(C)(=O)Oc2ccc(C(C)(C)c3ccc(O)cc3)cc2)cc1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 5/20 0.57
ESR2 Q92731 4/20 0.57
HPGD P15428 3/20 0.57
TSHR P16473 3/20 0.57
CYP3A4 P08684 2/20 0.57
AR P10275 1/20 0.57
SLC6A2 P23975 1/20 0.57
SLC6A4 P31645 1/20 0.57
HTR6 P50406 1/20 0.57
ESRRG P62508 1/20 0.57
SLC6A3 Q01959 1/20 0.57
HSD17B10 Q99714 1/20 0.57
ALDH1A1 P00352 3/20 0.50
MEN1 O00255 2/20 0.47
KMT2A Q03164 2/20 0.47
KDM4E B2RXH2 1/20 0.47
LMNA P02545 1/20 0.42
TYR P14679 1/20 0.42
ELANE P08246 1/20 0.38
MAPT P10636 3/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15946722 1.00 ESR1 (0.57) ESR1ESR2HPGDTSHRCYP3A4
SCHEMBL19562991 0.94 ALDH1A1 (0.62) ESR1ESR2HPGDTSHRCYP3A4
SCHEMBL19863306 0.94 CYP3A4 (0.50) ESR1ESR2HPGDTSHRCYP3A4
SCHEMBL16672003 0.94 CYP3A4 (0.50) ESR1ESR2HPGDTSHRCYP3A4
Bisphenol A SCHEMBL16446907 0.92 ESR1 (0.59) ESR1ESR2HPGDTSHRCYP3A4
SCHEMBL19308013 0.92 ESR2 (0.52) ESR1ESR2HPGDTSHRCYP3A4
SCHEMBL18774620 0.91 ESR1 (0.47) ESR1ESR2HPGDTSHRCYP3A4
SCHEMBL17880398 0.89 ESR1 (0.57) ESR1ESR2HPGDTSHRCYP3A4
SCHEMBL18716394 0.86 ESR1 (0.53) ESR1ESR2HPGDTSHRCYP3A4
SCHEMBL18774621 0.86 CYP3A4 (0.42) ESR1ESR2HPGDTSHRCYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20180126701-A1 HALOGEN-FREE THERMOSETTING RESIN COMPOSITION, PREPREG AND LAMINATE FOR PRINTED CIRCUIT BOARDS USING THE SAME SHENGYI TECHNOLOGY CO., LTD. (CN) 2018-05-10 US disclosed
US-20180126701-A1 HALOGEN-FREE THERMOSETTING RESIN COMPOSITION, PREPREG AND LAMINATE FOR PRINTED CIRCUIT BOARDS USING THE SAME SHENGYI TECHNOLOGY CO., LTD. (CN) 2018-05-10 US disclosed
EP-3241868-A1 HALOGEN-FREE THERMOSETTING RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUITS USING SAME Shengyi Technology Co. Ltd. (CN) 2017-11-08 EP disclosed
US-9752028-B2 Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit prepared from the same SHENGYI TECHNOLOGY CO., LTD. (CN) 2017-09-05 US disclosed
US-9611377-B2 Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the same SHENGYI TECHNOLOGY CO., LTD. (CN) 2017-04-04 US disclosed
US-20160185939-A1 HALOGEN-FREE THERMOSETTING RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUITS USING THE SAME SHENGYI TECHNOLOGY CO., LTD. (CN) 2016-06-30 US disclosed
US-20160185952-A1 Halogen-Free Thermosetting Resin Composition, Prepreg and Laminate for Printed Circuit Prepared From the Same SHENGYI TECHNOLOGY CO., LTD. (CN) 2016-06-30 US disclosed
US-20160185953-A1 Halogen-Free Thermosetting Resin Composition, Prepreg and Laminate for Printed Circuit Prepared From the Same SHENGYI TECHNOLOGY CO., LTD. (CN) 2016-06-30 US disclosed
US-9018286-B2 Flame retardant polycarbonate compositions, methods of manufacture thereof and articles comprising the same SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2015-04-28 US disclosed
US-9018286-B2 Flame retardant polycarbonate compositions, methods of manufacture thereof and articles comprising the same SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2015-04-28 US disclosed