⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL888115 | 0.78 | — | — | |
| SCHEMBL22440851 | 0.71 | — | — | |
| SCHEMBL21051674 | 0.67 | CYP2B6 (0.35) | — | |
| SCHEMBL5318650 | 0.66 | — | — | |
| SCHEMBL1364196 | 0.64 | — | — | |
| Bromide SCHEMBL8535084 | 0.64 | — | — | |
| Hydrochloric Acid SCHEMBL2580766 | 0.64 | — | — | |
| SCHEMBL28902775 | 0.62 | — | — | |
| SCHEMBL27838463 | 0.59 | — | — | |
| Trimethylammonium SCHEMBL27680775 | 0.59 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9851668-B2 | Fixing member, fixing device, and image forming apparatus | FUJI XEROX CO., LTD. (JP) | 2017-12-26 | — | — | US | claimed |
| US-20170261893-A1 | FIXING MEMBER, FIXING DEVICE, AND IMAGE FORMING APPARATUS | FUJI XEROX CO., LTD. (JP) | 2017-09-14 | — | — | US | claimed |
| CN-114868229-B | Dicing adhesive tape and method for manufacturing semiconductor chip | 麦克赛尔株式会社 | 2025-04-18 | — | — | CN | disclosed |
| US-20250059370-A1 | UV-CURABLE SILICONE COMPOSITION | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2025-02-20 | — | — | US | disclosed |
| US-20250051570-A1 | UV-CURABLE SILICONE COMPOSITION | MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC (JP) | 2025-02-13 | — | — | US | disclosed |
| EP-4450560-A1 | UV-CURABLE SILICONE COMPOSITION | Momentive Performance Materials Japan LLC (JP) | 2024-10-23 | — | — | EP | disclosed |
| EP-4450561-A1 | UV-CURABLE SILICONE COMPOSITION | Momentive Performance Materials Inc. (US) | 2024-10-23 | — | — | EP | disclosed |
| CN-112602172-B | Dicing adhesive tape and method for manufacturing semiconductor chip | 麦克赛尔株式会社 | 2024-10-15 | — | — | CN | disclosed |
| CN-115413286-A | Photocurable silicone composition and method for producing release liner | 迈图高新材料公司 | 2022-11-29 | — | — | CN | disclosed |
| CN-110938309-B | Silicone composition | KCC有机硅株式会社 | 2022-08-02 | — | — | CN | disclosed |
| CN-111278926-B | Curable silicone composition, resin sheet for optical member containing same, and light-emitting device | 陶氏东丽株式会社 | 2022-06-07 | — | — | CN | disclosed |
| CN-110072697-B | Laminate and electronic component manufacturing method | 陶氏东丽株式会社 | 2022-05-03 | — | — | CN | disclosed |
| WO-2021124725-A1 | ADHESIVE TAPE FOR DICING, AND METHOD FOR PRODUCING SEMICONDUCTOR CHIP | マクセルホールディングス株式会社 | 2021-06-24 | — | — | WO | disclosed |
| WO-2021124724-A1 | ADHESIVE TAPE FOR DICING AND METHOD FOR PRODUCING SEMICONDUCTOR CHIP | マクセルホールディングス株式会社 | 2021-06-24 | — | — | WO | disclosed |
| US-10961419-B2 | Layered body and method for manufacturing electronic component | DOW TORAY CO., LTD. (JP) | 2021-03-30 | — | — | US | disclosed |
| US-20190300767-A1 | LAYERED BODY AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | DOW TORAY CO., LTD. (JP) | 2019-10-03 | — | — | US | disclosed |
| EP-3533606-A1 | LAYERED BODY AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | Dow Toray Co., Ltd. (JP) | 2019-09-04 | — | — | EP | disclosed |
| US-9365757-B2 | UV-curable adhesive organopolysiloxane composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-06-14 | — | — | US | disclosed |
| US-20150124338-A1 | UV-CURABLE ADHESIVE ORGANOPOLYSILOXANE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-05-07 | — | — | US | disclosed |