Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NCEH1 | Q6PIU2 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16707418 | 0.91 | ALDH1A1 (0.31) | — | |
| SCHEMBL31084408 | 0.91 | ALDH1A1 (0.31) | — | |
| SCHEMBL29388728 | 0.87 | — | — | |
| SCHEMBL1741933 | 0.87 | — | — | |
| SCHEMBL17775580 | 0.85 | CYP1A2 (0.33) | — | |
| SCHEMBL28765357 | 0.84 | LMNA (0.33) | — | |
| SCHEMBL8779461 | 0.82 | POLB (0.30) | — | |
| SCHEMBL29489121 | 0.80 | MAPT (0.46) | — | |
| SCHEMBL9854216 | 0.80 | MAPT (0.46) | — | |
| SCHEMBL22721377 | 0.80 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2020071288-A1 | METAL-CLAD LAMINATE, WIRING BOARD, METAL FOIL PROVIDED WITH RESIN, AND RESIN COMPOSITION | パナソニックＩＰマネジメント株式会社 | 2020-04-09 | — | — | WO | disclosed |
| CN-109071745-A | Cyanate ester compound, method for producing same, resin composition, cured product, prepreg, sealing material, fiber-reinforced composite material, adhesive, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2018-12-21 | — | — | CN | disclosed |
| CN-107001767-B | Resin combination, prepreg, clad with metal foil plywood, resin compounded piece and printed circuit board | 三菱瓦斯化学株式会社 | 2018-11-02 | — | — | CN | disclosed |
| CN-107207855-B | Resin composition for printed circuit board, prepreg, resin compounded piece and clad with metal foil plywood | 三菱瓦斯化学株式会社 | 2018-09-11 | — | — | CN | disclosed |
| CN-107207834-B | Resin composition for printed circuit board, prepreg, clad with metal foil plywood, resin sheet and printed circuit board (PCB) | 三菱瓦斯化学株式会社 | 2018-05-29 | — | — | CN | disclosed |
| CN-105683154-B | Cyanate ester compound, curable resin composition containing the same, and cured product thereof | 三菱瓦斯化学株式会社 | 2018-03-16 | — | — | CN | disclosed |
| CN-107614566-A | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board | 三菱瓦斯化学株式会社 | 2018-01-19 | — | — | CN | disclosed |
| CN-107406577-A | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2017-11-28 | — | — | CN | disclosed |
| CN-107406582-A | Cyanate ester compound, curable resin composition containing the same, and cured product thereof | 三菱瓦斯化学株式会社 | 2017-11-28 | — | — | CN | disclosed |
| CN-107207855-A | Resin composition for printed circuit board, prepreg, resin compounded piece and clad with metal foil plywood | 三菱瓦斯化学株式会社 | 2017-09-26 | — | — | CN | disclosed |
| CN-107207834-A | Resin composition for printed circuit board, prepreg, clad with metal foil plywood, resin sheet and printed circuit board (PCB) | 三菱瓦斯化学株式会社 | 2017-09-26 | — | — | CN | disclosed |
| CN-107075090-A | Cyanate esters and its manufacture method, resin combination and solidfied material | 三菱瓦斯化学株式会社 | 2017-08-18 | — | — | CN | disclosed |
| CN-107001767-A | Resin combination, prepreg, clad with metal foil plywood, resin compounded piece and printed circuit board (PCB) | 三菱瓦斯化学株式会社 | 2017-08-01 | — | — | CN | disclosed |
| US-9647218-B2 | Organic electroluminescent materials and devices | UNIVERSAL DISPLAY CORPORATION (US) | 2017-05-09 | — | — | US | disclosed |
| US-20150129849-A1 | ORGANIC ELECTROLUMINESCENT MATERIALS AND DEVICES | UNIVERSAL DISPLAY CORPORATION | 2015-05-14 | — | — | US | disclosed |