SCHEMBL16711544

SCHEMBL16711544

CC(C)(c1ccc(OO)cc1)c1ccc(OCCO)cc1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 3/20 0.60
CYP3A4 P08684 1/20 0.60
KDM4E B2RXH2 8/20 0.49
MEN1 O00255 5/20 0.49
KMT2A Q03164 5/20 0.49
POLB P06746 2/20 0.49
LMNA P02545 2/20 0.49
PSMB1 P20618 1/20 0.47
PSMB5 P28074 1/20 0.47
PSMB2 P49721 1/20 0.47
NR1I2 O75469 1/20 0.47
ALDH1A1 P00352 7/20 0.47
RECQL P46063 1/20 0.47
HTT P42858 2/20 0.46
AR P10275 1/20 0.45
TP53 P04637 2/20 0.44
MAPT P10636 2/20 0.44
HPGD P15428 2/20 0.44
TSHR P16473 2/20 0.44
HIF1A Q16665 2/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL79031 0.93 SMN1; SMN2 (0.68) SMN1; SMN2CYP3A4KDM4EMEN1KMT2A
SCHEMBL9818198 0.93 SMN1; SMN2 (0.68) SMN1; SMN2CYP3A4KDM4EMEN1KMT2A
SCHEMBL13506719 0.88 SMN1; SMN2 (0.58) SMN1; SMN2CYP3A4KDM4EMEN1KMT2A
SCHEMBL9818138 0.87 SMN1; SMN2 (0.62) SMN1; SMN2CYP3A4KDM4EMEN1KMT2A
1,3-Propanediol SCHEMBL17704098 0.87 SMN1; SMN2 (0.62) SMN1; SMN2CYP3A4KDM4EMEN1KMT2A
SCHEMBL26736145 0.87 SMN1; SMN2 (0.62) SMN1; SMN2CYP3A4KDM4EMEN1KMT2A
Di(Hydroxyethyl)Ether SCHEMBL9469009 0.87 SMN1; SMN2 (0.62) SMN1; SMN2CYP3A4KDM4EMEN1KMT2A
SCHEMBL15890450 0.87 SMN1; SMN2 (0.62) SMN1; SMN2CYP3A4KDM4EMEN1KMT2A
SCHEMBL5707301 0.87 SMN1; SMN2 (0.62) SMN1; SMN2CYP3A4KDM4EMEN1KMT2A
SCHEMBL15127221 0.86 SMN1; SMN2 (0.60) SMN1; SMN2CYP3A4KDM4EMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20180194982-A1 THERMALLY CONDUCTIVE RESIN COMPOSITION KANEKA CORPORATION (JP) 2018-07-12 US disclosed
US-20180085977-A1 METAL RESIN COMPOSITE KANEKA CORPORATION (JP) 2018-03-29 US disclosed
US-20170317257-A1 LED LAMP HEAT SINK KANEKA CORPORATION (JP) 2017-11-02 US disclosed
US-20170167716-A1 AUTOMOTIVE LED LAMP HEAT SINK KANEKA CORPORATION (JP) 2017-06-15 US disclosed
US-9243106-B2 Method for continuous production of high molecular weight polycarbonate resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2016-01-26 US disclosed
US-20150133611-A1 METHOD FOR CONTINUOUS PRODUCTION OF HIGH MOLECULAR WEIGHT POLYCARBONATE RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2015-05-14 US disclosed