SCHEMBL1672208

SCHEMBL1672208

COC(=O)C1=C(C)N(C)C(C)=C(C(=O)OC)C1c1ccccc1[N+](=O)[O-]

nearest known ligand 0.70

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 7/20 0.70
KDM4E B2RXH2 5/20 0.70
MAPT P10636 4/20 0.70
ADORA3 P0DMS8 3/20 0.70
LMNA P02545 3/20 0.70
HSD17B10 Q99714 3/20 0.70
ALDH1A1 P00352 3/20 0.70
ABCC4 O15439 2/20 0.70
CACNA1F O60840 2/20 0.70
ABCB11 O95342 2/20 0.70
CYP1A2 P05177 2/20 0.70
ADORA2A P29274 2/20 0.70
ADORA1 P30542 2/20 0.70
OPRM1 P35372 2/20 0.70
SCN1A P35498 2/20 0.70
HTR2B P41595 2/20 0.70
CACNA1D Q01668 2/20 0.70
KCNH2 Q12809 2/20 0.70
CACNA1S Q13698 2/20 0.70
CACNA1C Q13936 2/20 0.70

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11683170 0.95 TSHR (0.65) TSHRKDM4EMAPTADORA3LMNA
SCHEMBL11810522 0.92 TSHR (0.61) TSHRKDM4EMAPTADORA3LMNA
SCHEMBL10733629 0.89 CACNA1F (0.76) TSHRKDM4EMAPTADORA3LMNA
SCHEMBL11447102 0.89 TSHR (0.57) TSHRKDM4EMAPTADORA3LMNA
SCHEMBL11742384 0.89 ADORA3 (0.57) TSHRKDM4EMAPTADORA3LMNA
SCHEMBL12994290 0.86 LMNA (0.66) TSHRKDM4EMAPTADORA3LMNA
SCHEMBL18253129 0.85 TSHR (0.53) TSHRKDM4EMAPTADORA3LMNA
SCHEMBL11821045 0.84 CACNA1D (0.63) TSHRKDM4EMAPTADORA3LMNA
Nifedipine SCHEMBL3968 0.83 ADORA3 (1.00) TSHRKDM4EMAPTADORA3LMNA
Nifedipine SCHEMBL1172946 0.83 ADORA3 (1.00) TSHRKDM4EMAPTADORA3LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 117 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8367190-B2 At low temperature, fast hardening composition for preparing protecting film, protecting film prepared therefrom, and substrate comprising the same LG CHEM, LTD. (KR) 2013-02-05 US claimed
US-20110084787-A1 PHOTOSENSITIVE RESIN COMPOSITION, METAL-BASE-CONTAINING CIRCUIT BOARD PRODUCTION METHOD EMPLOYING THE PHOTOSENSITIVE RESIN COMPOSITION, AND METAL-BASE-CONTAINING CIRCUIT BOARD NITTO DENKO CORPORATION (JP) 2011-04-14 US claimed
US-20100078598-A1 CONDUCTIVE POLYMER COMPOSITION FOR RADIOGRAPHIC IMAGING ELPANI CO., LTD. (KR) 2010-04-01 US claimed
US-20100080973-A1 LOW TEMPERATURE, FAST HARDENING COMPOSITION FOR PREPARING PROTECTING FILM, PROTECTING FILM PREPARED THEREFROM, AND SUBSTRATE COMPRISING THE SAME LG CHEM, LTD. (KR) 2010-04-01 US claimed
WO-2008035890-A9 AT LOW TEMPERATURE, FAST HARDENING COMPOSITION FOR PREPARING PROTECTING FILM, PROTECTING FILM PREPARED THEREFROM, AND SUBSTRATE COMPRISING THE SAME LG CHEMICAL LTD (KR) 2009-04-23 WO claimed
WO-2008091135-A1 CONDUCTIVE POLYMER COMPOSITION FOR RADIOGRAPHIC IMAGING ELPANI CO., LTD. (KR) 2008-07-31 WO claimed
EP-1935042-A1 ORGANIC LIGHT EMITTING DEVICES HAVING LATENT ACTIVATED LAYERS AND METHODS OF FABRICATING THE SAME General Electric Company (US) 2008-06-25 EP claimed
WO-2008035890-A1 AT LOW TEMPERATURE, FAST HARDENING COMPOSITION FOR PREPARING PROTECTING FILM, PROTECTING FILM PREPARED THEREFROM, AND SUBSTRATE COMPRISING THE SAME LG CHEM, LTD. (KR) 2008-03-27 WO claimed
WO-2007040728-A1 ORGANIC LIGHT EMITTING DEVICES HAVING LATENT ACTIVATED LAYERS AND METHODS OF FABRICATING THE SAME GENERAL ELECTRIC COMPANY (US) 2007-04-12 WO claimed
US-20070077452-A1 Organic light emitting devices having latent activated layers and methods of fabricating the same GENERAL ELECTRIC COMPANY 2007-04-05 US claimed
US-6740475-B2 INCLUDING A FILM-FORMING POLYMER CONTAINING MOLECULE GROUPS CONVERTABLE INTO ALKALI-SOLUBLE GROUPS BY ACID-CATALYZED REACTION, A PHOTOACID GENERATOR AND A THERMOBASE GENERATOR; SEMICONDUCTORS; CROSSLINKING INHIBITION; ACCURACY; SMOOTHNESS INFINEON TECHNOLOGIES AG (DE) 2004-05-25 US claimed
US-20020187436-A1 Method for structuring a photoresist layer POLARIS INNOVATIONS LIMITED (IE) 2002-12-12 US claimed
US-20020160317-A1 Method for structuring a photoresist layer POLARIS INNOVATIONS LIMITED (IE) 2002-10-31 US claimed
US-20020160318-A1 Method for structuring a photoresist layer POLARIS INNOVATIONS LIMITED (IE) 2002-10-31 US claimed
US-20020160316-A1 Process for structuring a photoresist layer POLARIS INNOVATIONS LIMITED (IE) 2002-10-31 US claimed
US-20020160315-A1 Process for structuring a photoresist layer POLARIS INNOVATIONS LIMITED (IE) 2002-10-31 US claimed
US-6245432-B1 METAL FOIL OVERCOATED WITH POLYIMIDE NITRO DENKO CORPORATION (JP) 2001-06-12 US claimed
US-6100582-A Circuit substrate, circuit-formed suspension substrate, and production method thereof NITTO DENKO CORPORATION (JP) 2000-08-08 US claimed
US-6096482-A Circuit substrate, circuit-formed suspension substrate, and production method thereof NITTO DENKO CORPORATION (JP) 2000-08-01 US claimed
US-5858518-A Circuit substrate, circuit-formed suspension substrate, and production method thereof NITTO DENKO CORPORATION (JP) 1999-01-12 US claimed