Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP2D6 | P10635 | 1/20 | 0.38 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.36 |
| ▸ | MC5R | P33032 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.34 |
| ▸ | MAPT | P10636 | 2/20 | 0.34 |
| ▸ | TP53 | P04637 | 1/20 | 0.34 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.34 |
| ▸ | TSHR | P16473 | 1/20 | 0.34 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.34 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.34 |
| ▸ | MEN1 | O00255 | 1/20 | 0.34 |
| ▸ | HPGD | P15428 | 1/20 | 0.34 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.34 |
| ▸ | ADRA2A | P08913 | 1/20 | 0.33 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.33 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.33 |
| ▸ | GAA | P10253 | 1/20 | 0.31 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.31 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.31 |
| ▸ | EED | O75530 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29497704 | 1.00 | CYP2D6 (0.38) | CYP2D6MAPK1MC5RALDH1A1MAPT | |
| Water SCHEMBL5596794 | 0.98 | CYP2D6 (0.37) | CYP2D6MAPK1MC5RALDH1A1MAPT | |
| SCHEMBL29497750 | 0.87 | CYP2D6 (0.38) | CYP2D6MAPK1MC5RALDH1A1MAPT | |
| SCHEMBL1673419 | 0.87 | CYP2D6 (0.38) | CYP2D6MAPK1MC5RALDH1A1MAPT | |
| SCHEMBL31329368 | 0.82 | CYP2D6 (0.36) | CYP2D6MAPK1MC5RALDH1A1MAPT | |
| SCHEMBL845626 | 0.81 | CYP2D6 (0.56) | CYP2D6ALDH1A1MAPTMEN1HPGD | |
| Water SCHEMBL5605435 | 0.80 | CYP2D6 (0.54) | CYP2D6ALDH1A1MAPTMEN1HPGD | |
| SCHEMBL31454831 | 0.78 | CYP1A2 (0.48) | ALDH1A1KMT2ASLC6A2SLC6A4TDP1 | |
| SCHEMBL845625 | 0.78 | CYP1A2 (0.48) | ALDH1A1KMT2ASLC6A2SLC6A4TDP1 | |
| SCHEMBL2754953 | 0.77 | ALDH1A1 (0.39) | CYP2D6ALDH1A1MAPTTP53CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 105 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116751547-A | Preparation method of mold compound, mold compound and semiconductor chip | 湖北三选科技有限公司 | 2023-09-15 | — | — | CN | claimed |
| JP-2088621-A | — | — | None | — | — | JP | disclosed |
| JP-5271386-A | — | — | None | — | — | JP | disclosed |
| EP-4703449-A1 | THERMALLY CONDUCTIVE COMPOSITION, TWO-COMPONENT CURABLE THERMALLY CONDUCTIVE MATERIAL, SUPPLY FORM OF TWO-COMPONENT CURABLE THERMALLY CONDUCTIVE MATERIAL, AND BATTERY MODULE | Sekisui Chemical Co., Ltd. (JP) | 2026-03-04 | — | — | EP | disclosed |
| EP-4660241-A1 | THERMALLY CONDUCTIVE RESIN COMPOSITION AND THERMALLY CONDUCTIVE MEMBER | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| EP-4660273-A1 | CURABLE THERMALLY CONDUCTIVE ADHESIVE AND THERMALLY CONDUCTIVE MEMBER | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| EP-4660272-A1 | CURABLE THERMALLY CONDUCTIVE ADHESIVE, THERMALLY CONDUCTIVE MEMBER, AND BATTERY ASSEMBLY | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| EP-4660274-A1 | CURABLE THERMOCONDUCTIVE ADHESIVE AND MODE FOR SUPPLYING SAME | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| EP-4660275-A1 | CURABLE HEAT-CONDUCTIVE ADHESIVE AGENT | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| EP-4660242-A1 | THERMALLY CONDUCTIVE RESIN COMPOSITION AND THERMALLY CONDUCTIVE MEMBER | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| CN-100587002-C | Curable resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component assembly | SEKISUI CHEMICAL CO LTD | 2010-02-03 | — | — | CN | disclosed |
| US-7645514-B2 | Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body | SEKISUI CHEMICAL CO., LTD. (JP) | 2010-01-12 | — | — | US | disclosed |
| CN-101490813-A | Dicing/die-bonding tape and method for manufacturing semiconductor chip | SEKISUI CHEMICAL CO LTD (JP) | 2009-07-22 | — | — | CN | disclosed |
| CN-101016402-A | Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body | SEKISUI CHEMICAL CO LTD (JP) | 2007-08-15 | — | — | CN | disclosed |
| US-20060154078-A1 | Curable high-molecular weight epoxy resin based on multicylcic monomer, dicylopentadiene dioxide, a glycidyl acrylate and a curing agent; no phase separation in matrix when dyed with a heavy metal; high adhesion and conduction accuracy; strength, heat/moisture resistance, flexibility; semiconductors | SEKISUI CHEMICAL CO., LTD. (JP) | 2006-07-13 | — | — | US | disclosed |
| CN-1735660-A | Curable resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component assembly | SEKISUI CHEMICAL CO LTD (JP) | 2006-02-15 | — | — | CN | disclosed |
| JP-2005330390-A | EPOXY RESIN COMPOSITION AND MOLDED MOTOR | YASKAWA ELECTRIC CORP | 2005-12-02 | — | — | JP | disclosed |
| EP-1584657-A1 | CURING RESIN COMPOSITION, ADHESIVE EPOXY RESIN PASTE, ADHESIVE EPOXY RESIN SHEET, CONDUCTIVE CONNECTION PASTE, CONDUCTIVE CONNECTION SHEET, AND ELECTRONIC COMPONENT JOINED BODY | SEKISUI CHEMICAL CO., LTD. (JP) | 2005-10-12 | — | — | EP | disclosed |
| JP-H05271386-A | EPOXY RESIN COMPOSITION AND LAMINATED SHEET USING THE SAME | DAINIPPON INK & CHEM INC | 1993-10-19 | — | — | JP | disclosed |
| JP-H0288621-A | EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR | MITSUBISHI ELECTRIC CORP | 1990-03-28 | — | — | JP | disclosed |