Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 1/20 | 0.48 |
| ▸ | CYP2A6 | P11509 | 1/20 | 0.48 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.43 |
| ▸ | ACHE | P22303 | 1/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.42 |
| ▸ | POLB | P06746 | 1/20 | 0.42 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.42 |
| ▸ | HRH3 | Q9Y5N1 | 1/20 | 0.42 |
| ▸ | HTR2A | P28223 | 2/20 | 0.42 |
| ▸ | HTR2C | P28335 | 2/20 | 0.42 |
| ▸ | HTR2B | P41595 | 2/20 | 0.42 |
| ▸ | DRD4 | P21917 | 1/20 | 0.42 |
| ▸ | SLC6A2 | P23975 | 4/20 | 0.41 |
| ▸ | SLC6A4 | P31645 | 4/20 | 0.41 |
| ▸ | SLC6A3 | Q01959 | 4/20 | 0.41 |
| ▸ | HTR7 | P34969 | 1/20 | 0.41 |
| ▸ | HTR3A | P46098 | 1/20 | 0.41 |
| ▸ | HTR4 | Q13639 | 1/20 | 0.41 |
| ▸ | AIMP2 | Q13155 | 1/20 | 0.41 |
| ▸ | KDM1A | O60341 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31454831 | 1.00 | CYP1A2 (0.48) | CYP1A2CYP2A6KMT2AACHEALDH1A1 | |
| SCHEMBL2754953 | 0.92 | ALDH1A1 (0.39) | CYP1A2CYP2A6KMT2AACHEALDH1A1 | |
| SCHEMBL1673434 | 0.90 | CYP1A2 (0.34) | CYP1A2CYP2A6KMT2AACHEALDH1A1 | |
| Water SCHEMBL5596576 | 0.88 | ACHE (0.33) | CYP1A2CYP2A6KMT2AACHEALDH1A1 | |
| SCHEMBL12292914 | 0.81 | CYP1A2 (0.46) | CYP1A2CYP2A6KMT2AALDH1A1SLC6A2 | |
| SCHEMBL14063152 | 0.81 | HRH3 (0.35) | ALDH1A1HRH3 | |
| SCHEMBL6942749 | 0.81 | HRH3 (0.47) | CYP1A2CYP2A6KMT2AACHEALDH1A1 | |
| SCHEMBL29910984 | 0.79 | CYP1A2 (0.47) | CYP1A2CYP2A6KMT2AACHEHRH3 | |
| SCHEMBL9420904 | 0.79 | PTGS1 (0.49) | CYP1A2CYP2A6KMT2ASLC6A2SLC6A3 | |
| SCHEMBL31329366 | 0.78 | TDP1 (0.44) | KMT2AALDH1A1POLBL3MBTL1SLC6A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 204 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4703449-A1 | THERMALLY CONDUCTIVE COMPOSITION, TWO-COMPONENT CURABLE THERMALLY CONDUCTIVE MATERIAL, SUPPLY FORM OF TWO-COMPONENT CURABLE THERMALLY CONDUCTIVE MATERIAL, AND BATTERY MODULE | Sekisui Chemical Co., Ltd. (JP) | 2026-03-04 | — | — | EP | disclosed |
| EP-4692939-A1 | METHOD FOR USING DEGRADABLE FILM AND METHOD FOR PRODUCING RESIST PATTERN | LINTEC CORPORATION (JP) | 2026-02-11 | — | — | EP | disclosed |
| EP-4660273-A1 | CURABLE THERMALLY CONDUCTIVE ADHESIVE AND THERMALLY CONDUCTIVE MEMBER | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| EP-4660243-A1 | CURABLE COMPOSITION AND THERMALLY CONDUCTIVE MEMBER | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| EP-4660275-A1 | CURABLE HEAT-CONDUCTIVE ADHESIVE AGENT | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| EP-4660274-A1 | CURABLE THERMOCONDUCTIVE ADHESIVE AND MODE FOR SUPPLYING SAME | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| EP-4660241-A1 | THERMALLY CONDUCTIVE RESIN COMPOSITION AND THERMALLY CONDUCTIVE MEMBER | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| EP-4660242-A1 | THERMALLY CONDUCTIVE RESIN COMPOSITION AND THERMALLY CONDUCTIVE MEMBER | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| EP-4660272-A1 | CURABLE THERMALLY CONDUCTIVE ADHESIVE, THERMALLY CONDUCTIVE MEMBER, AND BATTERY ASSEMBLY | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| CN-114830268-B | Slurry for forming varistor, cured product thereof, and varistor | 纳美仕有限公司 | 2024-11-26 | — | — | CN | disclosed |
| CN-101016402-A | Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body | SEKISUI CHEMICAL CO LTD (JP) | 2007-08-15 | — | — | CN | disclosed |
| US-20060154078-A1 | Curable high-molecular weight epoxy resin based on multicylcic monomer, dicylopentadiene dioxide, a glycidyl acrylate and a curing agent; no phase separation in matrix when dyed with a heavy metal; high adhesion and conduction accuracy; strength, heat/moisture resistance, flexibility; semiconductors | SEKISUI CHEMICAL CO., LTD. (JP) | 2006-07-13 | — | — | US | disclosed |
| CN-1735660-A | Curable resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component assembly | SEKISUI CHEMICAL CO LTD (JP) | 2006-02-15 | — | — | CN | disclosed |
| EP-1584657-A1 | CURING RESIN COMPOSITION, ADHESIVE EPOXY RESIN PASTE, ADHESIVE EPOXY RESIN SHEET, CONDUCTIVE CONNECTION PASTE, CONDUCTIVE CONNECTION SHEET, AND ELECTRONIC COMPONENT JOINED BODY | SEKISUI CHEMICAL CO., LTD. (JP) | 2005-10-12 | — | — | EP | disclosed |
| EP-0611826-B1 | Processes for production of optically active epoxides | DAICEL CHEM (JP) | 2003-05-02 | — | — | EP | disclosed |
| US-5672504-A | TREATING MIXED EPOXIDE ENANTIOMORPHS WITH MICROORGANISMS TO INCREASE CONCENTRATION OF OPTICALLY PURE S-ENANTIOMORPHS | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1997-09-30 | — | — | US | disclosed |
| EP-0358326-B1 | Process for preparing a zinc-containing solid catalyst and process for preparing polyalkylene carbonate | MITSUI PETROCHEMICAL IND (JP) | 1996-12-27 | — | — | EP | disclosed |
| EP-0611826-A2 | Processes for production of optically active epoxides | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1994-08-24 | — | — | EP | disclosed |
| US-4981948-A | PULVERIZED REACTION PRODUCT OF ZINC OXIDE AND DICARBOXYLIC ACID | MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) | 1991-01-01 | — | — | US | disclosed |
| EP-0358326-A1 | Process for preparing a zinc-containing solid catalyst and process for preparing polyalkylene carbonate | MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) | 1990-03-14 | — | — | EP | disclosed |