Acrylic Acid

Acrylic Acid

SCHEMBL1674849

C=CC(=O)O.CCOC=C(OCC)C(=O)O

nearest known ligand 0.38

Full drug profile on Sugi Atlas →

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
HCAR2 Q8TDS4 1/20 0.38
LMNA P02545 2/20 0.37
HSD17B10 Q99714 2/20 0.34
ALOX15 P16050 2/20 0.34
ALDH1A1 P00352 4/20 0.33
TSHR P16473 2/20 0.32
HPGD P15428 1/20 0.32
MGAM O43451 1/20 0.31
GAA P10253 1/20 0.31
SI P14410 1/20 0.31
MGAM2 Q2M2H8 1/20 0.31
SOAT1 P35610 1/20 0.31
CYP2D6 P10635 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2030378 0.90 ALDH1A1 (0.40) HCAR2LMNAHSD17B10ALOX15ALDH1A1
SCHEMBL2030377 0.90 ALDH1A1 (0.40) HCAR2LMNAHSD17B10ALOX15ALDH1A1
SCHEMBL28432679 0.77 HCAR2 (0.42) HCAR2LMNAHSD17B10ALDH1A1TSHR
SCHEMBL8349829 0.76 HCAR2 (0.39) HCAR2LMNAHSD17B10ALOX15ALDH1A1
SCHEMBL8349838 0.76 HCAR2 (0.39) HCAR2LMNAHSD17B10ALOX15ALDH1A1
Acrylic Acid SCHEMBL893192 0.76 LMNA (0.39) LMNAHSD17B10ALOX15ALDH1A1TSHR
SCHEMBL11109345 0.74 ALDH1A1 (0.44) HCAR2LMNAHSD17B10ALOX15ALDH1A1
SCHEMBL6074988 0.74 NPSR1 (0.43) HCAR2LMNAHSD17B10ALOX15ALDH1A1
SCHEMBL10710391 0.74 MGAM (0.32) HCAR2ALDH1A1MGAMGAASI
SCHEMBL2778172 0.74 NPSR1 (0.43) HCAR2LMNAHSD17B10ALOX15ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4069792-A1 MICHAEL REACTION-CURING HYBRID SYSTEM FOR USE IN CHEMICAL FASTENING TECHNOLOGY fischerwerke GmbH & Co. KG (DE) 2022-10-12 EP disclosed
WO-2021110621-A1 MICHAEL REACTION-CURING HYBRID SYSTEM FOR USE IN CHEMICAL FASTENING TECHNOLOGY FISCHERWERKE GMBH & CO. KG (DE) 2021-06-10 WO disclosed
US-10851199-B2 Epoxy (meth) acrylate compound and curable composition containing same SHOWA DENKO K. K. (JP) 2020-12-01 US disclosed
US-20190153149-A1 EPOXY (METH) ACRYLATE COMPOUND AND CURABLE COMPOSITION CONTAINING SAME SHOWA DENKO K. K. (JP) 2019-05-23 US disclosed
EP-1837352-B1 ACTIVE ENERGY RAY-CURABLE COMPOSITION AND CURED PRODUCT THEREOF KANEKA CORP (JP) 2015-03-04 EP disclosed
EP-1947129-B1 PHOTORADICAL- AND PHOTOCATION-CURABLE COMPOSITION KANEKA CORP (JP) 2014-12-10 EP disclosed
US-8389630-B2 Curable composition KANEKA CORPORATION (JP) 2013-03-05 US disclosed
EP-1970408-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2011-12-28 EP disclosed
EP-1961786-B1 CURABLE COMPOSITION FOR DAMPING MATERIAL AND DAMPING MATERIAL KANEKA CORP (JP) 2011-04-06 EP disclosed
US-20100227949-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2010-09-09 US disclosed
US-20080249246-A1 Composition For On-Site Forming Gasket, Gasket, (Meth) Acrylic Polymer and Curing Composition Thereof KANEKA CORPORATION (JP) 2008-10-09 US disclosed
EP-1970408-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2008-09-17 EP disclosed
EP-1961786-A1 CURABLE COMPOSITION FOR DAMPING MATERIAL AND DAMPING MATERIAL Kaneka Corporation (JP) 2008-08-27 EP disclosed
EP-1947129-A1 PHOTORADIAL- AND PHOTOCATION-CURABLE COMPOSITION Kaneka Corporation (JP) 2008-07-23 EP disclosed
EP-1923431-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2008-05-21 EP disclosed
EP-1873175-A1 CURABLE COMPOSITION, ADHESIVE COMPOSITION CONTAINING SUCH CURABLE COMPOSITION, AND ADHESIVE Kaneka Corporation (JP) 2008-01-02 EP disclosed
EP-1837352-A1 ACTIVE ENERGY RAY-CURABLE COMPOSITION AND CURED PRODUCT THEREOF Kaneka Corporation (JP) 2007-09-26 EP disclosed
EP-1679345-A1 COMPOSITION FOR ON-SITE FORMING GASKET, GASKET, (METH)ACRYLIC POLYMER AND CURING COMPOSITION THEREOF KANEKA CORPORATION (JP) 2006-07-12 EP disclosed
EP-0470262-B1 COPPER ALLOY COMPOSITION ASAHI CHEMICAL IND (JP) 1999-06-16 EP disclosed
US-5242511-A COPPER ALLOY COMPOSITIONS ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1993-09-07 US disclosed