SCHEMBL1679154

SCHEMBL1679154

CC(C)C(C)CNO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Sulfuric Acid SCHEMBL8584349 0.87 CYP2D6 (0.32)
SCHEMBL277768 0.72 ADH1B (0.32)
SCHEMBL464755 0.72
SCHEMBL23638028 0.71
SCHEMBL21837345 0.71
SCHEMBL5478947 0.69
Hydrochloric Acid SCHEMBL873558 0.69
SCHEMBL439784 0.69
SCHEMBL7967492 0.69
SCHEMBL1720389 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118265753-A Gel comprising supramolecular nanotubes of single-stranded magnets 雷恩国立应用科学学院 2024-06-28 CN disclosed
US-20210395645-A1 CLEANING LIQUID FUJIFILM ELECTRONIC MATERIALS CO., LTD. (JP) 2021-12-23 US disclosed
US-20210317391-A1 KIT FOR CLEANING AGENT AND METHOD FOR PREPARING CLEANING AGENT FUJIFILM ELECTRONIC MATERIALS CO., LTD. (JP) 2021-10-14 US disclosed
WO-2020195343-A1 CLEANING LIQUID 富士フイルムエレクトロニクスマテリアルズ株式会社 2020-10-01 WO disclosed
US-9862914-B2 Cleaning agent for semiconductor substrates and method for processing semiconductor substrate surface WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2018-01-09 US disclosed
EP-3051577-B1 CLEANING AGENT FOR SEMICONDUCTOR SUBSTRATES AND METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE SURFACE WAKO PURE CHEM IND LTD (JP) 2017-10-18 EP disclosed
US-20160272924-A1 CLEANING AGENT FOR SEMICONDUCTOR SUBSTRATES AND METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE SURFACE WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2016-09-22 US disclosed
EP-3051577-A1 CLEANING AGENT FOR SEMICONDUCTOR SUBSTRATES AND METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE SURFACE Wako Pure Chemical Industries, Ltd. (JP) 2016-08-03 EP disclosed
US-20160060584-A1 CLEANING AGENT FOR METAL WIRING SUBSTRATE, AND METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2016-03-03 US disclosed
EP-2985783-A1 CLEANING AGENT FOR METAL WIRING SUBSTRATE, AND METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE Wako Pure Chemical Industries, Ltd. (JP) 2016-02-17 EP disclosed
EP-2647693-A1 SUBSTRATE CLEANER FOR COPPER WIRING, AND METHOD FOR CLEANING COPPER WIRING SEMICONDUCTOR SUBSTRATE Wako Pure Chemical Industries, Ltd. (JP) 2013-10-09 EP disclosed
US-20130261040-A1 SUBSTRATE CLEANER FOR COPPER WIRING, AND METHOD FOR CLEANING COPPER WIRING SEMICONDUCTOR SUBSTRATE WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2013-10-03 US disclosed
US-7923573-B2 Benzene compound having 2 or more substituents DAIICHI SANKYO COMPANY, LIMITED (JP) 2011-04-12 US disclosed
US-20080255111-A1 Tissue Factor Production Inhibitor SANKYO COMPANY LIMITED (JP) 2008-10-16 US disclosed
EP-1806332-A1 BENZENE COMPOUND HAVING 2 OR MORE SUBSTITUENTS Daiichi Sankyo Company, Limited (JP) 2007-07-11 EP disclosed
EP-1764075-A1 TISSUE FACTOR PRODUCTION INHIBITOR Sankyo Company, Limited (JP) 2007-03-21 EP disclosed
EP-0046271-B1 PHOTOSENSITIVE COMPOSITIONS AND ELEMENTS CONTAINING SUBSTITUTED HYDROXYLAMINE E.I. DU PONT DE NEMOURS AND COMPANY (US) 1983-10-19 EP disclosed