SCHEMBL1685367

SCHEMBL1685367

CC1CCC(C2(C)CO2)CC1

nearest known ligand 0.31

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.31
PKM P14618 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2706490 0.76 MAPK1 (0.32)
SCHEMBL2706488 0.76 MAPK1 (0.32)
SCHEMBL13342645 0.70 L3MBTL1 (0.37)
SCHEMBL8428196 0.69 CA1 (0.33)
SCHEMBL14362122 0.69
SCHEMBL19105129 0.68 CA1 (0.33)
SCHEMBL32015 0.67 CYP3A4 (0.33)
SCHEMBL14117296 0.67 CYP3A4 (0.33)
SCHEMBL22837673 0.66 LMNA (0.31)
SCHEMBL11469288 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5098590-A Mixing a chlorine bleach stable surfactant, a stabilizer and water with a thickener precursor, entraining air bubbles and homogenizing COLGATE PALMOLIVE CO. (US) 1992-03-24 US claimed
US-5075027-A Containing tripolyphosphate, silicate, thickeners, surfactants and bleaches COLGATE PALMOLIVE CO. (US) 1991-12-24 US claimed
EP-2508545-B1 Thermosetting resin composition and photosemiconductor encapsulation material ASAHI KASEI CHEMICALS CORP (JP) 2014-06-18 EP disclosed
EP-1947128-B1 THERMOSETTING RESIN COMPOSITION AND PHOTOSEMICONDUCTOR ENCAPSULATION MATERIAL ASAHI KASEI CHEMICALS CORP (JP) 2013-10-09 EP disclosed
EP-2508545-A1 Thermosetting resin composition and photosemiconductor encapsulation material Asahi Kasei Chemicals Corporation (JP) 2012-10-10 EP disclosed
US-7932319-B2 Thermosetting resin composition and semiconductor sealing medium ASAHI KASEI CHEMICALS CORPORATION (JP) 2011-04-26 US disclosed
US-20090258992-A1 Thermosetting Resin Composition and Semiconductor Sealing Medium ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-10-15 US disclosed
EP-1947128-A1 THERMOSETTING RESIN COMPOSITION AND PHOTOSEMICONDUCTOR ENCAPSULATION MATERIAL Asahi Kasei Kogyo Kabushiki Kaisha (JP) 2008-07-23 EP disclosed
EP-1023034-A1 COSMETIC FORMULATIONS FOR THE PREVENTION AND THERAPY OF HAIR LOSS Verona, Giancarlo (IT) 2000-08-02 EP disclosed
EP-0963194-A1 NITRILE PERFUMERY MATERIAL Bush Boake Allen Inc. (US) 1999-12-15 EP disclosed
WO-1999026601-A1 NITRILE PERFUMERY MATERIAL BUSH BOAKE ALLEN INC. (US) 1999-06-03 WO disclosed
WO-1999020232-A1 COSMETIC FORMULATIONS FOR THE PREVENTION AND THERAPY OF HAIR LOSS VERONA GIANCARLO (IT) 1999-04-29 WO disclosed
US-5888962-A CONTAINING 3-METHYL-5-(PHENYL OR CYCLOHEXYL)-PENTANENITRILE BUSH BOAKE ALLEN INC. (US) 1999-03-30 US disclosed
US-5098590-A Mixing a chlorine bleach stable surfactant, a stabilizer and water with a thickener precursor, entraining air bubbles and homogenizing COLGATE PALMOLIVE CO. (US) 1992-03-24 US disclosed
US-5075027-A Containing tripolyphosphate, silicate, thickeners, surfactants and bleaches COLGATE PALMOLIVE CO. (US) 1991-12-24 US disclosed