SCHEMBL16854091

SCHEMBL16854091

COCc1cc(C)c(O)c(COC)c1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SHBG P04278 1/20 0.52
PRKCE Q02156 3/20 0.47
MYLK Q15746 2/20 0.47
TDP1 Q9NUW8 2/20 0.47
MEN1 O00255 1/20 0.47
ALDH1A1 P00352 1/20 0.47
PRKCG P05129 1/20 0.47
MAPT P10636 1/20 0.47
PRKCA P17252 1/20 0.47
APEX1 P27695 1/20 0.47
RECQL P46063 1/20 0.47
KMT2A Q03164 1/20 0.47
PTGS1 P23219 2/20 0.36
PTGS2 P35354 2/20 0.36
HMGB1 P09429 1/20 0.36
CXCL12 P48061 1/20 0.36
CA1 P00915 1/20 0.36
CA2 P00918 1/20 0.36
POLB P06746 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12430322 0.92 SHBG (0.53) SHBGPRKCEMYLKTDP1MEN1
SCHEMBL25446772 0.90 SHBG (0.47) SHBGPRKCEMYLKTDP1MEN1
SCHEMBL30416054 0.90 SHBG (0.66) SHBGPRKCEMYLKTDP1MEN1
SCHEMBL13090303 0.90 SHBG (0.66) SHBGPRKCEMYLKTDP1MEN1
SCHEMBL9191718 0.89 CA1 (0.46) SHBGPRKCEMYLKTDP1MEN1
SCHEMBL14949891 0.89 PRKCE (0.52) SHBGPRKCEMYLKTDP1MEN1
SCHEMBL25446790 0.88 SHBG (0.54) SHBGPRKCEMYLKTDP1MEN1
SCHEMBL19600585 0.87 SHBG (0.49) SHBGPRKCEMYLKTDP1MEN1
SCHEMBL27984728 0.86 SHBG (0.47) SHBGPRKCEMYLKTDP1MEN1
SCHEMBL14432651 0.86 SHBG (0.47) SHBGPRKCEMYLKTDP1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10920017-B2 Polyimide resin and resin composition KANEKA CORPORATION (JP) 2021-02-16 US disclosed
EP-3203320-B9 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE TORAY INDUSTRIES (JP) 2020-05-06 EP disclosed
EP-3203320-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE TORAY INDUSTRIES (JP) 2019-10-23 EP disclosed
US-10409163-B2 Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device TORAY INDUSTRIES, INC. (JP) 2019-09-10 US disclosed
US-20190263968-A1 POLYIMIDE RESIN AND RESIN COMPOSITION KANEKA CORPORATION (JP) 2019-08-29 US disclosed
US-20170285477-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-05 US disclosed
EP-3203320-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Toray Industries, Inc. (JP) 2017-08-09 EP disclosed
US-9405188-B2 Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device SAMSUNG SDI CO., LTD. (KR) 2016-08-02 US disclosed
US-20150177617-A1 Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Display Device SAMSUNG SDI CO., LTD. (KR) 2015-06-25 US disclosed