SCHEMBL19600585

SCHEMBL19600585

COCc1cc(C)c(O)c(CCO)c1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SHBG P04278 1/20 0.49
PRKCE Q02156 3/20 0.37
MYLK Q15746 2/20 0.37
MEN1 O00255 1/20 0.37
ALDH1A1 P00352 1/20 0.37
PRKCG P05129 1/20 0.37
MAPT P10636 1/20 0.37
PRKCA P17252 1/20 0.37
APEX1 P27695 1/20 0.37
RECQL P46063 1/20 0.37
KMT2A Q03164 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
PTGS2 P35354 5/20 0.35
PTGS1 P23219 2/20 0.35
TNKS2 Q9H2K2 1/20 0.33
CYP2D6 P10635 1/20 0.33
HTR2C P28335 1/20 0.33
ALOX5 P09917 4/20 0.32
HMGB1 P09429 1/20 0.32
CXCL12 P48061 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19600586 0.90 SHBG (0.59) SHBGPRKCEMYLKMEN1ALDH1A1
SCHEMBL19600596 0.89 PRKCE (0.43) SHBGPRKCEMYLKMEN1ALDH1A1
SCHEMBL16850509 0.88 SHBG (0.50) SHBGPRKCEMYLKMEN1ALDH1A1
SCHEMBL16854091 0.87 SHBG (0.52) SHBGPRKCEMYLKMEN1ALDH1A1
SCHEMBL12430322 0.84 SHBG (0.53) SHBGPRKCEMYLKMEN1ALDH1A1
SCHEMBL19600594 0.83 TDP1 (0.37) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL25446772 0.82 SHBG (0.47) SHBGPRKCEMYLKMEN1ALDH1A1
SCHEMBL9191718 0.81 CA1 (0.46) SHBGPRKCEMYLKMEN1ALDH1A1
SCHEMBL16207219 0.81 SHBG (0.46) SHBGPRKCEMYLKMEN1ALDH1A1
SCHEMBL15686504 0.81 SHBG (0.46) SHBGPRKCEMYLKMEN1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350305-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND TREATMENT LIQUID FUJIFILM CORPORATION (JP) 2023-11-02 US disclosed
US-20170327644-A1 RESIN AND PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2017-11-16 US disclosed