⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9701827 | 0.77 | — | — | |
| SCHEMBL393554 | 0.73 | — | — | |
| SCHEMBL372509 | 0.73 | TSHR (0.38) | — | |
| SCHEMBL532756 | 0.71 | TSHR (0.30) | — | |
| SCHEMBL12344858 | 0.71 | — | — | |
| SCHEMBL14175020 | 0.71 | — | — | |
| Iodide SCHEMBL7701882 | 0.71 | TSHR (0.36) | — | |
| SCHEMBL986680 | 0.71 | — | — | |
| SCHEMBL5948626 | 0.71 | TSHR (0.36) | — | |
| SCHEMBL20353900 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 70 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4306566-B1 | CURABLE RESIN COMPOSITION, CURED PRODUCT AND ADHESIVE | ADEKA CORP (JP) | 2026-05-06 | — | — | EP | disclosed |
| US-12590178-B2 | Curable resin composition and method for suppressing curing shrinkage of curable resin composition | ADEKA CORPORATION (JP) | 2026-03-31 | — | — | US | disclosed |
| EP-4306567-B1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE | ADEKA CORP (JP) | 2025-06-04 | — | — | EP | disclosed |
| US-12269917-B2 | Curable resin composition | ADEKA CORPORATION (JP) | 2025-04-08 | — | — | US | disclosed |
| US-20250109240-A1 | ONE-PACK TYPE EPOXY RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2025-04-03 | — | — | US | disclosed |
| US-20250109324-A1 | CURING AGENT FOR EPOXY RESIN, AND ADHESIVE | SUNSTAR ENGINEERING INC. (JP) | 2025-04-03 | — | — | US | disclosed |
| WO-2025062839-A1 | COMPOUND, EPOXY RESIN, CURABLE COMPOSITION, MATERIAL FOR RECYCLING, CURED ARTICLE, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING DECOMPOSITION PRODUCT, AND DECOMPOSITION METHOD | 株式会社ADEKA | 2025-03-27 | — | — | WO | disclosed |
| WO-2025047655-A1 | BLOCK URETHANE MATERIAL, COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND BLOCK URETHANE COMPOUND CONTAINED THEREIN | 株式会社ADEKA | 2025-03-06 | — | — | WO | disclosed |
| EP-4491653-A1 | ONE-PACK TYPE EPOXY RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2025-01-15 | — | — | EP | disclosed |
| US-20250002707-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE | ADEKA CORPORATION (JP) | 2025-01-02 | — | — | US | disclosed |
| WO-2014011587-A1 | BREAKER FLUID | M-I L.L.C. (US) | 2014-01-16 | — | — | WO | disclosed |
| WO-2012116032-A1 | CHELATE COMPOSITIONS AND METHODS AND FLUIDS FOR USE IN OILFIELD OPERATIONS | M-I L.L.C. (US) | 2012-08-30 | — | — | WO | disclosed |
| US-20110214874-A1 | NON-AQUEOUS BREAKER FLUIDS AND METHODS OF USE THEREOF | M-I L.L.C. (US) | 2011-09-08 | — | — | US | disclosed |
| EP-2352898-A2 | NON-AQUEOUS BREAKER FLUIDS AND METHODS OF USE THEREOF | M-I LLC (US) | 2011-08-10 | — | — | EP | disclosed |
| US-20110095453-A1 | ONE LIQUID TYPE CYANATE-EPOXY COMPOSITE RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2011-04-28 | — | — | US | disclosed |
| US-20110053811-A1 | METHODS FOR PREVENTING OR REMEDIATING XANTHAN DEPOSITION | M-I L.L.C. (US) | 2011-03-03 | — | — | US | disclosed |
| EP-2245107-A2 | METHODS FOR PREVENTING OR REMEDIATING XANTHAN DEPOSITION | M.I L.L, C. (US) | 2010-11-03 | — | — | EP | disclosed |
| WO-2010053904-A2 | NON-AQUEOUS BREAKER FLUIDS AND METHODS OF USE THEREOF | M-I L.L.C. (US) | 2010-05-14 | — | — | WO | disclosed |
| WO-2009091652-A2 | METHODS FOR PREVENTING OR REMEDIATING XANTHAN DEPOSITION | M-I L.L.C. (US) | 2009-07-23 | — | — | WO | disclosed |
| US-4230183-A | CHELATE OF COBALT, NICKEL, IRON, CHROMIUM, OR COPPER | TEXACO INC. (US) | 1980-10-28 | — | — | US | disclosed |