Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1685493 | 0.89 | ALDH1A1 (0.37) | TSHR | |
| SCHEMBL1685442 | 0.88 | — | — | |
| SCHEMBL1685494 | 0.87 | OPRM1 (0.44) | — | |
| SCHEMBL6544840 | 0.87 | — | — | |
| SCHEMBL3946973 | 0.85 | — | — | |
| SCHEMBL6579135 | 0.84 | OPRM1 (0.42) | TSHR | |
| SCHEMBL6545143 | 0.83 | — | — | |
| SCHEMBL6544930 | 0.83 | — | — | |
| SCHEMBL9761739 | 0.81 | ALDH1A1 (0.40) | TSHR | |
| Ammonia Solution, Strong SCHEMBL8451494 | 0.81 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 95 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6960315-B2 | Method for forming moldings from dimer fatty acid free polyamides | HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) | 2005-11-01 | — | — | US | claimed |
| EP-4306566-B1 | CURABLE RESIN COMPOSITION, CURED PRODUCT AND ADHESIVE | ADEKA CORP (JP) | 2026-05-06 | — | — | EP | disclosed |
| US-12590178-B2 | Curable resin composition and method for suppressing curing shrinkage of curable resin composition | ADEKA CORPORATION (JP) | 2026-03-31 | — | — | US | disclosed |
| EP-4619469-A1 | THERMOPLASTIC HOTMELT ADHESIVE COMPOSITION WITH FLAME RETARDANT | Henkel AG & Co. KGaA (DE) | 2025-09-24 | — | — | EP | disclosed |
| US-20250270428-A1 | THERMOPLASTIC HOTMELT ADHESIVE COMPOSITION WITH FLAME RETARDANT | HENKEL AG & CO KGAA (DE) | 2025-08-28 | — | — | US | disclosed |
| EP-4306567-B1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE | ADEKA CORP (JP) | 2025-06-04 | — | — | EP | disclosed |
| US-12269917-B2 | Curable resin composition | ADEKA CORPORATION (JP) | 2025-04-08 | — | — | US | disclosed |
| US-20250109240-A1 | ONE-PACK TYPE EPOXY RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2025-04-03 | — | — | US | disclosed |
| US-20250109324-A1 | CURING AGENT FOR EPOXY RESIN, AND ADHESIVE | SUNSTAR ENGINEERING INC. (JP) | 2025-04-03 | — | — | US | disclosed |
| WO-2025062839-A1 | COMPOUND, EPOXY RESIN, CURABLE COMPOSITION, MATERIAL FOR RECYCLING, CURED ARTICLE, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING DECOMPOSITION PRODUCT, AND DECOMPOSITION METHOD | 株式会社ADEKA | 2025-03-27 | — | — | WO | disclosed |
| EP-1976901-A2 | USE OF POLYSULFIDE-CONTAINING TWO-COMPONENT ADHESIVES FOR THE PRODUCTION OF WINDOWS | H.B. FULLER LICENSING & FINANCING, INC. (US) | 2008-10-08 | — | — | EP | disclosed |
| US-20080196831-A1 | METHOD OF ADHESIVELY BONDING A FIRST COMPONENT TO A SECOND COMPONENT | HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (HENKEL KGAA) (DE) | 2008-08-21 | — | — | US | disclosed |
| EP-1956063-A2 | Method for bonding one component with a second component | Henkel AG & Co. KGaA (DE) | 2008-08-13 | — | — | EP | disclosed |
| WO-2008064950-A1 | MOLDED PARTS FROM HOT MELT ADHESIVES | HENKEL AG & CO. KGAA (DE) | 2008-06-05 | — | — | WO | disclosed |
| WO-2007085291-A2 | USE OF POLYSULFIDE-CONTAINING TWO-COMPONENT ADHESIVES FOR THE PRODUCTION OF WINDOWS | H.B. FULLER LICENSING & FINANCING, INC. (US) | 2007-08-02 | — | — | WO | disclosed |
| EP-1311584-B1 | MOULDED PARTS MADE OF POLYAMIDES WHICH ARE FREE OF DIMERIC ACIDS | HENKEL KGAA (DE) | 2007-03-07 | — | — | EP | disclosed |
| US-6960315-B2 | Method for forming moldings from dimer fatty acid free polyamides | HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) | 2005-11-01 | — | — | US | disclosed |
| US-20030173707-A1 | Moulded parts made of polyamides which are free of dimeric acids | HENKEL AG & CO. KGAA (DE) | 2003-09-18 | — | — | US | disclosed |
| EP-1311584-A1 | MOULDED PARTS MADE OF POLYAMIDES WHICH ARE FREE OF DIMERIC ACIDS | Henkel Kommanditgesellschaft auf Aktien (DE) | 2003-05-21 | — | — | EP | disclosed |
| WO-2002016472-A1 | MOULDED PARTS MADE OF POLYAMIDES WHICH ARE FREE OF DIMERIC ACIDS | HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) | 2002-02-28 | — | — | WO | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12590178-B2 | Curable resin composition and method for suppressing curing shrinkage of curable resin composition | SEM1, RER1, JMJD6 | TSHR 2947/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.