⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL29065711 | 0.97 | — | — | |
| SCHEMBL1517146 | 0.78 | — | — | |
| SCHEMBL1757341 | 0.78 | PRMT3 (0.32) | — | |
| SCHEMBL181414 | 0.78 | PRMT3 (0.33) | — | |
| SCHEMBL2196022 | 0.76 | PRMT3 (0.48) | — | |
| SCHEMBL4786657 | 0.75 | — | — | |
| SCHEMBL1081915 | 0.75 | — | — | |
| SCHEMBL6335189 | 0.74 | — | — | |
| SCHEMBL18315355 | 0.74 | — | — | |
| SCHEMBL17099796 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4306566-B1 | CURABLE RESIN COMPOSITION, CURED PRODUCT AND ADHESIVE | ADEKA CORP (JP) | 2026-05-06 | — | — | EP | disclosed |
| US-12590178-B2 | Curable resin composition and method for suppressing curing shrinkage of curable resin composition | ADEKA CORPORATION (JP) | 2026-03-31 | — | — | US | disclosed |
| EP-4306567-B1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE | ADEKA CORP (JP) | 2025-06-04 | — | — | EP | disclosed |
| US-12269917-B2 | Curable resin composition | ADEKA CORPORATION (JP) | 2025-04-08 | — | — | US | disclosed |
| US-20250109324-A1 | CURING AGENT FOR EPOXY RESIN, AND ADHESIVE | SUNSTAR ENGINEERING INC. (JP) | 2025-04-03 | — | — | US | disclosed |
| US-20250109240-A1 | ONE-PACK TYPE EPOXY RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2025-04-03 | — | — | US | disclosed |
| WO-2025062839-A1 | COMPOUND, EPOXY RESIN, CURABLE COMPOSITION, MATERIAL FOR RECYCLING, CURED ARTICLE, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING DECOMPOSITION PRODUCT, AND DECOMPOSITION METHOD | 株式会社ADEKA | 2025-03-27 | — | — | WO | disclosed |
| WO-2025047655-A1 | BLOCK URETHANE MATERIAL, COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND BLOCK URETHANE COMPOUND CONTAINED THEREIN | 株式会社ADEKA | 2025-03-06 | — | — | WO | disclosed |
| EP-4491653-A1 | ONE-PACK TYPE EPOXY RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2025-01-15 | — | — | EP | disclosed |
| US-20250002707-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE | ADEKA CORPORATION (JP) | 2025-01-02 | — | — | US | disclosed |
| WO-2022190745-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE | 株式会社ADEKA | 2022-09-15 | — | — | WO | disclosed |
| WO-2022190746-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT AND ADHESIVE | 株式会社ADEKA | 2022-09-15 | — | — | WO | disclosed |
| WO-2022168665-A1 | NOVEL COMPOUND, AND CURABLE RESIN COMPOSITION CONTAINING SAID COMPOUND | 株式会社ADEKA | 2022-08-11 | — | — | WO | disclosed |
| WO-2022168666-A1 | CURABLE RESIN COMPOSITION | 株式会社ADEKA | 2022-08-11 | — | — | WO | disclosed |
| WO-2022168670-A1 | CHARGE TRANSFER COMPLEX | 株式会社ADEKA | 2022-08-11 | — | — | WO | disclosed |
| EP-4029896-A1 | CURABLE RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2022-07-20 | — | — | EP | disclosed |
| US-20220185946-A1 | CURABLE RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2022-06-16 | — | — | US | disclosed |
| EP-3950761-A1 | CURABLE RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2022-02-09 | — | — | EP | disclosed |
| US-8911586-B2 | One liquid type cyanate-epoxy composite resin composition | ADEKA CORPORATION (JP) | 2014-12-16 | — | — | US | disclosed |
| US-20110095453-A1 | ONE LIQUID TYPE CYANATE-EPOXY COMPOSITE RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2011-04-28 | — | — | US | disclosed |