SCHEMBL16969656

SCHEMBL16969656

CCCCCCCCC(Cl)C(O)(Cl)Cl

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.43
FDPS P14324 4/20 0.42
GPR84 Q9NQS5 4/20 0.39
SPHK1 Q9NYA1 2/20 0.39
FFAR1 O14842 1/20 0.39
MAPT P10636 2/20 0.38
LCK P06239 1/20 0.38
PPARD Q03181 1/20 0.38
ZDHHC20 Q5W0Z9 1/20 0.38
ZDHHC2 Q9UIJ5 1/20 0.38
DNM1 Q05193 1/20 0.37
BLM P54132 2/20 0.37
HSPD1 P10809 1/20 0.37
HSPE1 P61604 1/20 0.37
CYP2D6 P10635 2/20 0.36
GMNN O75496 1/20 0.36
POLB P06746 1/20 0.36
THPO P40225 1/20 0.36
MTOR P42345 1/20 0.36
KDM4E B2RXH2 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16969895 1.00 LMNA (0.43) LMNAFDPSGPR84SPHK1FFAR1
SCHEMBL16969843 1.00 LMNA (0.43) LMNAFDPSGPR84SPHK1FFAR1
SCHEMBL16969854 0.98 FDPS (0.39) LMNAFDPSGPR84SPHK1FFAR1
SCHEMBL2270760 0.91 FDPS (0.36) LMNAFDPSDNM1CYP3A4
SCHEMBL16970042 0.86 LMNA (0.43) LMNAFDPSGPR84SPHK1FFAR1
SCHEMBL16969588 0.86 LMNA (0.43) LMNAFDPSGPR84SPHK1FFAR1
SCHEMBL16970044 0.86 LMNA (0.43) LMNAFDPSGPR84SPHK1FFAR1
SCHEMBL577931 0.86 LMNA (0.43) LMNAFDPSGPR84SPHK1FFAR1
SCHEMBL16970129 0.84 LMNA (0.44) LMNAFDPSGPR84SPHK1FFAR1
SCHEMBL16969790 0.84 LMNA (0.44) LMNAFDPSGPR84SPHK1FFAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2905349-B1 Ag ball, solder joint, formed solder, solder paste and silver paste SENJU METAL INDUSTRY CO (JP) 2017-05-17 EP disclosed
US-9266196-B2 Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2016-02-23 US disclosed
EP-2905349-A2 Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2015-08-12 EP disclosed
US-20150217409-A1 Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE Senju Metal lndustry Co., Ltd. (JP) 2015-08-06 US disclosed