SCHEMBL16969728

SCHEMBL16969728

OC=CCCCCCl

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16969595 0.97
SCHEMBL16970029 0.97 ALDH1A1 (0.35)
SCHEMBL16969561 0.97 ALDH1A1 (0.35)
SCHEMBL3760030 0.91
SCHEMBL10958972 0.81 FASN (0.32)
SCHEMBL6433945 0.81 TDP1 (0.43)
SCHEMBL6433946 0.81 TDP1 (0.43)
SCHEMBL8819736 0.78
SCHEMBL8378245 0.78 ALDH1A1 (0.42)
SCHEMBL31029273 0.78 ALDH1A1 (0.42)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118318024-A Liquid crystal compound 罗利克技术有限公司 2024-07-09 CN disclosed
CN-113166649-B Mesogenic compounds 光学转变有限公司 2024-05-28 CN disclosed
CN-113122269-B Ultraviolet light absorber 光学转变公司 2024-05-28 CN disclosed
CN-117355337-A Protein-macromolecule conjugates and methods of use thereof 奥迪曼药业科技有限公司 2024-01-05 CN disclosed
CN-111511739-B Dihydropyrimidinyl thiazoles for the treatment and prophylaxis of hepatitis b virus infections 豪夫迈·罗氏有限公司 2023-09-15 CN disclosed
EP-2905349-B1 Ag ball, solder joint, formed solder, solder paste and silver paste SENJU METAL INDUSTRY CO (JP) 2017-05-17 EP disclosed
US-9266196-B2 Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2016-02-23 US disclosed
EP-2905349-A2 Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2015-08-12 EP disclosed
US-20150217409-A1 Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE Senju Metal lndustry Co., Ltd. (JP) 2015-08-06 US disclosed