SCHEMBL3760030

SCHEMBL3760030

OC=CCCCCl

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16969728 0.91
SCHEMBL16969561 0.88 ALDH1A1 (0.35)
SCHEMBL16970029 0.88 ALDH1A1 (0.35)
SCHEMBL16969595 0.88
SCHEMBL8819736 0.80
SCHEMBL6432180 0.79 TSHR (0.46)
SCHEMBL6435337 0.79 TSHR (0.46)
SCHEMBL3575500 0.75
SCHEMBL3575503 0.75
SCHEMBL28999196 0.73 TSHR (0.40)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20100311989-A1 PROCESS FOR THE PREPARATION OF RENIN INHIBITORS VITAE PHARMACEUTICALS, INC. 2010-12-09 US claimed
WO-2009038715-A1 PROCESS FOR THE PREPARATION OF RENIN INHIBITORS VITAE PHARMACEUTICALS, INC. (US) 2009-03-26 WO claimed
CN-109071750-B Long-lasting cosmetic composition 生活实验公司 2022-08-02 CN disclosed
CN-106572955-B Non-petrochemical derived cationic emulsifiers and related compositions and methods 伊诺莱克斯投资公司 2021-02-19 CN disclosed
EP-2905349-B1 Ag ball, solder joint, formed solder, solder paste and silver paste SENJU METAL INDUSTRY CO (JP) 2017-05-17 EP disclosed
US-9266196-B2 Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2016-02-23 US disclosed
EP-2905349-A2 Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2015-08-12 EP disclosed
US-20150217409-A1 Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE Senju Metal lndustry Co., Ltd. (JP) 2015-08-06 US disclosed
US-20100311989-A1 PROCESS FOR THE PREPARATION OF RENIN INHIBITORS VITAE PHARMACEUTICALS, INC. 2010-12-09 US disclosed
WO-2009038715-A1 PROCESS FOR THE PREPARATION OF RENIN INHIBITORS VITAE PHARMACEUTICALS, INC. (US) 2009-03-26 WO disclosed