Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.35 |
| ▸ | TSHR | P16473 | 2/20 | 0.35 |
| ▸ | EP300 | Q09472 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16970253 | 1.00 | ALDH1A1 (0.35) | ALDH1A1TSHREP300TDP1 | |
| SCHEMBL16970020 | 0.97 | — | — | |
| SCHEMBL16970362 | 0.88 | — | — | |
| SCHEMBL11613483 | 0.78 | ALDH1A1 (0.35) | ALDH1A1TSHRTDP1 | |
| SCHEMBL11661337 | 0.78 | ALDH1A1 (0.35) | ALDH1A1TSHRTDP1 | |
| SCHEMBL6821570 | 0.76 | ALDH1A1 (0.33) | ALDH1A1TSHRTDP1 | |
| SCHEMBL16970306 | 0.76 | — | — | |
| SCHEMBL9550541 | 0.74 | TBXAS1 (0.38) | ALDH1A1TSHREP300 | |
| SCHEMBL11615994 | 0.74 | ALDH1A1 (0.32) | ALDH1A1TSHR | |
| SCHEMBL11615990 | 0.74 | ALDH1A1 (0.32) | ALDH1A1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2905349-B1 | Ag ball, solder joint, formed solder, solder paste and silver paste | SENJU METAL INDUSTRY CO (JP) | 2017-05-17 | — | — | EP | disclosed |
| US-9266196-B2 | Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste | SENJU METAL INDUSTRY CO., LTD. (JP) | 2016-02-23 | — | — | US | disclosed |
| EP-2905349-A2 | Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste | SENJU METAL INDUSTRY CO., LTD. (JP) | 2015-08-12 | — | — | EP | disclosed |
| US-20150217409-A1 | Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE | Senju Metal lndustry Co., Ltd. (JP) | 2015-08-06 | — | — | US | disclosed |