⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4755274 | 0.97 | — | — | |
| SCHEMBL4454284 | 0.78 | — | — | |
| SCHEMBL4949032 | 0.76 | — | — | |
| SCHEMBL20267752 | 0.75 | LMNA (0.38) | — | |
| SCHEMBL14892497 | 0.73 | — | — | |
| SCHEMBL8372986 | 0.73 | — | — | |
| SCHEMBL18079252 | 0.73 | SMN1; SMN2 (0.37) | — | |
| SCHEMBL28444025 | 0.73 | TSHR (0.33) | — | |
| SCHEMBL14763324 | 0.73 | — | — | |
| SCHEMBL27842210 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119859373-A | Polyurethane composite material and preparation process and application thereof | 科思创德国股份有限公司 | 2025-04-22 | — | — | CN | claimed |
| CN-114716874-B | Hydrophilic treatment-free plate protective adhesive and preparation method thereof | 安徽强邦新材料股份有限公司 | 2022-12-27 | — | — | CN | claimed |
| CN-114716874-A | Hydrophilic treatment-free plate protective adhesive and preparation method thereof | 安徽强邦新材料股份有限公司 | 2022-07-08 | — | — | CN | claimed |
| CN-119859373-A | Polyurethane composite material and preparation process and application thereof | 科思创德国股份有限公司 | 2025-04-22 | — | — | CN | disclosed |
| CN-111793459-B | Novel flame-retardant low-shrinkage polyurethane foam joint mixture | 安徽南大星新材料科技有限公司 | 2023-03-28 | — | — | CN | disclosed |
| CN-113272364-B | Silicone-polyacrylate copolymers, sealants including silicone-polyacrylate copolymers, and related methods | 美国陶氏有机硅公司 | 2023-03-24 | — | — | CN | disclosed |
| CN-113272363-B | Silicone-organic copolymers, sealants including silicone-organic copolymers, and related methods | 美国陶氏有机硅公司 | 2023-02-17 | — | — | CN | disclosed |
| CN-114716874-B | Hydrophilic treatment-free plate protective adhesive and preparation method thereof | 安徽强邦新材料股份有限公司 | 2022-12-27 | — | — | CN | disclosed |
| CN-114716874-A | Hydrophilic treatment-free plate protective adhesive and preparation method thereof | 安徽强邦新材料股份有限公司 | 2022-07-08 | — | — | CN | disclosed |
| CN-113272362-B | Silicone-polyester copolymers, sealants including silicone-polyester copolymers, and related methods | 美国陶氏有机硅公司 | 2022-06-17 | — | — | CN | disclosed |
| CN-114541141-A | Polymerizable composition for bonding fiber units | 鲁道夫有限公司 | 2022-05-27 | — | — | CN | disclosed |
| CN-113195594-B | Silicone-polycarbonate copolymers, sealants including silicone-polycarbonate copolymers, and related methods | 美国陶氏有机硅公司 | 2022-03-29 | — | — | CN | disclosed |
| CN-113272362-A | Silicone-polyester copolymers, sealants including silicone-polyester copolymers, and related methods | 美国陶氏有机硅公司 | 2021-08-17 | — | — | CN | disclosed |
| CN-113272363-A | Silicone-organic copolymers, sealants including silicone-organic copolymers, and related methods | 美国陶氏有机硅公司 | 2021-08-17 | — | — | CN | disclosed |
| CN-113272364-A | Silicone-polyacrylate copolymers, sealants including silicone-polyacrylate copolymers, and related methods | 美国陶氏有机硅公司 | 2021-08-17 | — | — | CN | disclosed |
| CN-113195594-A | Silicone-polycarbonate copolymers, sealants including silicone-polycarbonate copolymers, and related methods | 美国陶氏有机硅公司 | 2021-07-30 | — | — | CN | disclosed |
| EP-2905349-B1 | Ag ball, solder joint, formed solder, solder paste and silver paste | SENJU METAL INDUSTRY CO (JP) | 2017-05-17 | — | — | EP | disclosed |
| US-9266196-B2 | Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste | SENJU METAL INDUSTRY CO., LTD. (JP) | 2016-02-23 | — | — | US | disclosed |
| EP-2905349-A2 | Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste | SENJU METAL INDUSTRY CO., LTD. (JP) | 2015-08-12 | — | — | EP | disclosed |
| US-20150217409-A1 | Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE | Senju Metal lndustry Co., Ltd. (JP) | 2015-08-06 | — | — | US | disclosed |