⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2310423 | 1.00 | — | — | |
| SCHEMBL892357 | 0.75 | — | — | |
| SCHEMBL2995044 | 0.75 | — | — | |
| SCHEMBL892356 | 0.75 | — | — | |
| Water SCHEMBL5684260 | 0.73 | TRPA1 (0.30) | — | |
| SCHEMBL18860351 | 0.71 | — | — | |
| SCHEMBL6063640 | 0.71 | — | — | |
| SCHEMBL845432 | 0.71 | LPAR2 (0.33) | — | |
| SCHEMBL295389 | 0.71 | — | — | |
| SCHEMBL892176 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 93 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230265235-A1 | CURABLE POLYFARNESENE-BASED COMPOSITIONS | FINA TECHNOLOGY, INC. (US) | 2023-08-24 | — | — | US | disclosed |
| US-11634531-B2 | Curable polyfarnesene-based compositions | FINA TECHNOLOGY, INC. (US) | 2023-04-25 | — | — | US | disclosed |
| US-20190016847-A1 | CURABLE POLYFARNESENE-BASED COMPOSITIONS | FINA TECHNOLOGY, INC. (US) | 2019-01-17 | — | — | US | disclosed |
| EP-3400249-A2 | CURABLE POLYFARNESENE-BASED COMPOSITIONS | Fina Technology, Inc. (US) | 2018-11-14 | — | — | EP | disclosed |
| US-9793456-B2 | Molded resin body for surface-mounted light-emitting device, manufacturing method thereof, and surface-mounted light-emitting device | KANEKA CORPORATION (JP) | 2017-10-17 | — | — | US | disclosed |
| WO-2017065864-A2 | CURABLE POLYFARNESENE-BASED COMPOSITIONS | FINA TECHNOLOGY, INC. (US) | 2017-04-20 | — | — | WO | disclosed |
| US-9496468-B2 | Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode | KANEKA CORPORATION (JP) | 2016-11-15 | — | — | US | disclosed |
| US-9178120-B2 | Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode | KANEKA CORPORATION (JP) | 2015-11-03 | — | — | US | disclosed |
| US-20150188008-A1 | CURABLE RESIN COMPOSITION, CURABLE RESIN COMPOSITION TABLET, MOLDED BODY, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR COMPONENT AND LIGHT EMITTING DIODE | KANEKA CORPORATION (JP) | 2015-07-02 | — | — | US | disclosed |
| US-20150008455-A1 | MOLDED RESIN BODY FOR SURFACE-MOUNTED LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF, AND SURFACE-MOUNTED LIGHT-EMITTING DEVICE | KANEKA CORPORATION (JP) | 2015-01-08 | — | — | US | disclosed |
| US-5567833-A | CURING AGENT HAVING AT LEAST TWO HYDROSILYL GROUPS IN MOLECULE PREPARED BY REACTING UNSATURATED COMPOUND WITH POLYVALENT HYDROGENSILICON COMPOUND IN PRESENCE OF HYDROSILATION CATALYST | KANEGAFUCHI CHEMICAL INDUSTRY CO., LTD. (JP) | 1996-10-22 | — | — | US | disclosed |
| EP-0431173-B1 | CURING AGENT, METHOD OF PREPARATION THEREOF, AND CURABLE COMPOSITION PREPARED THEREFROM | KANEGAFUCHI CHEMICAL IND (JP) | 1995-08-02 | — | — | EP | disclosed |
| US-5409995-A | Mixture of hydrosilation product of an unsaturated compound and a cyclic silicone; an unsaturated polyester,-ether, -carbonate or addition polymer; receptivity; fast cure; complete cure; stability | KANEGAFUCHI CHEMICAL INDUSTRY CO., LTD. (JP) | 1995-04-25 | — | — | US | disclosed |
| EP-0434840-B1 | ORGANIC POLYMER, PREPARATION THEREOF, AND CURABLE COMPOSITION COMPRISING SAME | KANEGAFUCHI CHEMICAL IND (JP) | 1995-02-22 | — | — | EP | disclosed |
| US-5130413-A | Forming a metal salt of the polyoxyalkylene oxide by reaction with alkali metal alkoxide and reaction with a halogen unsaturated compound | KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1992-07-14 | — | — | US | disclosed |
| US-5120379-A | Hydrolyzable silicon groups endcapping polyisobutylene and hydrogenated polybutadiene; storage stable, weatherproof | KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1992-06-09 | — | — | US | disclosed |
| EP-0434840-A1 | ORGANIC POLYMER, PREPARATION THEREOF, AND CURABLE COMPOSITION COMPRISING SAME | Kanegafuchi Chemical Industry Co., Ltd. (JP) | 1991-07-03 | — | — | EP | disclosed |
| EP-0431173-A1 | CURING AGENT, METHOD OF PREPARATION THEREOF, AND CURABLE COMPOSITION PREPARED THEREFROM | Kanegafuchi Chemical Industry Co., Ltd. (JP) | 1991-06-12 | — | — | EP | disclosed |
| EP-0415404-A2 | Process for producing unsaturated group-terminated high-molecular weight polyalkylene oxide | KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1991-03-06 | — | — | EP | disclosed |
| US-3971751-A | ROOM TEMPERATURE | KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JA) | 1976-07-27 | — | — | US | disclosed |